• In semiconductor fabrication, a resist is a thin layer used to transfer a circuit pattern to the semiconductor substrate which it is deposited upon. A...
    5 KB (607 words) - 20:41, 16 May 2024
  • Thumbnail for Semiconductor device fabrication
    Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors...
    109 KB (11,593 words) - 16:33, 27 September 2024
  • (semiconductor fabrication), applied to semiconductor fabrication Resist (Kosheen album), or the title song Resist (Midnight Oil album), 2022 Resist (Within...
    2 KB (320 words) - 07:53, 17 January 2024
  • Thumbnail for Doping (semiconductor)
    In semiconductor production, doping is the intentional introduction of impurities into an intrinsic (undoped) semiconductor for the purpose of modulating...
    35 KB (4,525 words) - 17:33, 6 September 2024
  • Thumbnail for Resist
    applications of the resist principle have recently developed in microelectronics and nanotechnology. An example is resists in semiconductor fabrication, using photoresists...
    6 KB (735 words) - 03:45, 27 January 2024
  • Thumbnail for MOSFET
    advantages of the device, notably ease of fabrication and its application in integrated circuits. Usually the semiconductor of choice is silicon. Some chip manufacturers...
    99 KB (11,949 words) - 02:40, 25 September 2024
  • Thumbnail for CMOS
    metal–oxide–semiconductor (CMOS, pronounced "sea-moss", /siːmɑːs/, /-ɒs/) is a type of metal–oxide–semiconductor field-effect transistor (MOSFET) fabrication process...
    57 KB (6,532 words) - 16:49, 26 September 2024
  • Thumbnail for Photoresist
    Photoresist (redirect from Negative resist)
    A photoresist (also known simply as a resist) is a light-sensitive material used in several processes, such as photolithography and photoengraving, to...
    29 KB (3,241 words) - 09:30, 11 August 2024
  • photoresist. Photolithography is the most common method for the semiconductor fabrication of integrated circuits ("ICs" or "chips"), such as solid-state...
    58 KB (6,445 words) - 02:12, 12 September 2024
  • Thumbnail for Sheet resistance
    made by semiconductor doping, metal deposition, resistive paste printing, and glass coating. Examples of these processes are: doped semiconductor regions...
    9 KB (1,250 words) - 07:12, 23 July 2024
  • layers from the surface of a wafer during semiconductor device fabrication fab – a semiconductor fabrication plant fan-out wafer-level packaging – an extension...
    14 KB (1,689 words) - 11:55, 18 October 2023
  • Thumbnail for CHIPS and Science Act
    trained semiconductor engineers in the United States. In May 2022, Texas Instruments broke ground on new 300-mm semiconductor wafer fabrication plants...
    129 KB (12,389 words) - 19:25, 27 September 2024
  • Thumbnail for Integrated circuit
    integration was made practical by technological advancements in semiconductor device fabrication. Since their origins in the 1960s, the size, speed, and capacity...
    87 KB (9,261 words) - 08:32, 27 September 2024
  • Ultrapure water (category Semiconductor device fabrication)
    for different users. The primary industries using UPW are: semiconductor devices fabrication process solar photovoltaics pharmaceuticals power generation...
    64 KB (8,433 words) - 15:21, 24 September 2024
  • Thumbnail for Integrated circuit packaging
    Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents...
    15 KB (1,597 words) - 20:25, 22 April 2024
  • Thumbnail for Moore's law
    (named after Arthur Rock), which is that the capital cost of a semiconductor fabrication plant also increases exponentially over time. Numerous innovations...
    104 KB (10,692 words) - 15:53, 25 September 2024
  • Thumbnail for Quantum dot
    techniques result in less expensive and less time-consuming methods of semiconductor fabrication. Quantum dots are usually coated with organic capping ligands...
    113 KB (13,191 words) - 20:30, 10 September 2024
  • Thumbnail for Electron-beam lithography
    low throughput, limiting its usage to photomask fabrication, low-volume production of semiconductor devices, and research and development. Electron-beam...
    38 KB (4,736 words) - 09:02, 10 July 2024
  • Spreading resistance profiling (category Semiconductor device fabrication)
    analysis (SRA), is a technique used to analyze resistivity versus depth in semiconductors. Semiconductor devices depend on the distribution of carriers...
    8 KB (1,090 words) - 17:11, 18 March 2024
  • The piezoresistive effect is a change in the electrical resistivity of a semiconductor or metal when mechanical strain is applied. In contrast to the piezoelectric...
    15 KB (1,820 words) - 09:16, 28 May 2024
  • 3 nm process (category International Technology Roadmap for Semiconductors lithography nodes)
    late 2016, TSMC announced plans to construct a 5 nm–3 nm node semiconductor fabrication plant with a co-commitment investment of around US$15.7 billion...
    44 KB (3,687 words) - 02:06, 25 September 2024
  • Thumbnail for X-ray lithography
    X-ray lithography is a process used in semiconductor device fabrication industry to selectively remove parts of a thin film of photoresist. It uses X-rays...
    12 KB (1,623 words) - 17:49, 28 December 2022
  • Transfer length method (category Semiconductors)
    technique used in semiconductor physics and engineering to determine the specific contact resistivity between a metal and a semiconductor. TLM has been developed...
    28 KB (5,096 words) - 17:24, 26 September 2024
  • throughput, limiting single-column e-beams to photomask fabrication, low-volume production of semiconductor devices, and research and development. Multiple-electron...
    16 KB (1,682 words) - 09:17, 28 May 2024
  • Thumbnail for Printed circuit board
    innovations in the technology of printed electronic circuits and the fabrication of capacitors. This invention also represents a step in the development...
    85 KB (10,823 words) - 15:47, 27 September 2024
  • Thumbnail for MEMS
    cantilevers can deform over time. The fabrication of MEMS evolved from the process technology in semiconductor device fabrication, i.e. the basic techniques are...
    45 KB (5,605 words) - 04:10, 21 September 2024
  • Chemical-mechanical polishing (category Semiconductor device fabrication)
    etching and free abrasive polishing. It is used in the semiconductor industry to polish semiconductor wafers as part of the integrated circuit manufacturing...
    9 KB (1,330 words) - 15:35, 19 September 2024
  • Hardmask (category Semiconductor device fabrication)
    hardmask is a material used in semiconductor processing as an etch mask instead of a polymer or other organic "soft" resist material. Hardmasks are necessary...
    3 KB (356 words) - 08:29, 16 July 2022
  • Thumbnail for SU-8 photoresist
    provide a high-resolution mask for fabrication of semiconductor devices. It is now mainly used in the fabrication of microfluidics (mainly via soft lithography...
    14 KB (1,718 words) - 12:28, 6 September 2024
  • Thumbnail for Epitaxy
    Epitaxy (category Semiconductor device fabrication)
    nanotechnology and in semiconductor fabrication. Indeed, epitaxy is the only affordable method of high quality crystal growth for many semiconductor materials. In...
    30 KB (3,600 words) - 22:11, 2 September 2024