A die, in the context of integrated circuits, is a small block of semiconducting material on which a given functional circuit is fabricated. Typically...

An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...

Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents...

A three-dimensional integrated circuit (3D IC) is a MOS (metal-oxide semiconductor) integrated circuit (IC) manufactured by stacking as many as 16 or more...

mixed-signal integrated circuit is any integrated circuit that has both analog circuits and digital circuits on a single semiconductor die. Their usage...

A die shot or die photography is a photo or recording of the layout of an integrated circuit, showings its design with any packaging removed. A die shot...

Integrated circuit design, semiconductor design, chip design or IC design, is a sub-field of electronics engineering, encompassing the particular logic...

An application-specific integrated circuit (ASIC /ˈeɪsɪk/) is an integrated circuit (IC) chip customized for a particular use, rather than intended for...

(Darkness). Dies (surname), a surname of Dutch, Flemish, and Frisian origin Die (integrated circuit), when used plurally Misspelling of Dice Die (disambiguation)...

The first planar monolithic integrated circuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was born...

Power management integrated circuits (power management ICs or PMICs or PMU as unit) are integrated circuits for power management. Although PMIC refers...

A hybrid integrated circuit (HIC), hybrid microcircuit, hybrid circuit or simply hybrid is a miniaturized electronic circuit constructed of individual...

numbers Die (integrated circuit), a rectangular piece of a semiconductor wafer Die (manufacturing), a material-shaping device Die (philately) Coin die, a metallic...

devices or integrated circuits. Individual components are fabricated on semiconductor wafers (commonly silicon) before being diced into die, tested, and...

the general performance and verification requirements of single die integrated circuit device type electronics. It is a performance-based specification...

The 4000 series is a CMOS logic family of integrated circuits (ICs) first introduced in 1968 by RCA. It was slowly migrated into the 4000B buffered series...

A 2.5D integrated circuit (2.5D IC) is an advanced packaging technique that combines multiple integrated circuit dies in a single package without stacking...

During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional...

series is a popular logic family of transistor–transistor logic (TTL) integrated circuits (ICs). In 1964, Texas Instruments introduced the SN5400 series of...

Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage...

graphics memory. IGPs can be integrated onto a motherboard as part of its northbridge chipset, or on the same die (integrated circuit) with the CPU (like AMD...

A smart card (SC), chip card, or integrated circuit card (ICC or IC card), is a card used to control access to a resource. It is typically a plastic credit...

delidding of an integrated circuit (IC) is the process of removing the protective cover or integrated heat spreader (IHS) of an integrated circuit so that the...

die shrinks to either full nodes or half-nodes rests with the foundry and not the integrated circuit designer. Electronics portal Integrated circuit Semiconductor...

are small, conductive surface areas of a printed circuit board (PCB) or die of an integrated circuit. They are often made of gold, copper, or aluminum...

integrated circuit (IC) by combining millions or billions of MOS transistors onto a single chip. VLSI began in the 1970s when MOS integrated circuit (Metal...

self-contained fixed linear voltage regulator integrated circuits. The 78xx family is commonly used in electronic circuits requiring a regulated power supply due...

device (typically on a single substrate or silicon die). It is the most common measure of integrated circuit complexity (although the majority of transistors...

A system in a package (SiP) or system-in-package is a number of integrated circuits (ICs) enclosed in one chip carrier package or encompassing an IC package...

Thru-Silicon Stacking). A 3D integrated circuit (3D IC) is a single integrated circuit built by stacking silicon wafers and/or dies and interconnecting them...