• Wafer-scale integration (WSI) is a system of building very-large integrated circuit (commonly called a "chip") networks from an entire silicon wafer to...
    10 KB (1,282 words) - 05:20, 31 July 2024
  • Thumbnail for Integrated circuit
    stands for "ultra-large-scale integration" was proposed for chips of more than 1 million transistors. Wafer-scale integration (WSI) is a means of building...
    87 KB (9,261 words) - 18:01, 15 October 2024
  • Thumbnail for Wafer-level packaging
    chip-scale package (CSP) technology, since the resulting package is practically of the same size as the die. Wafer-level packaging allows integration of...
    6 KB (724 words) - 23:58, 25 October 2024
  • Thumbnail for Very-large-scale integration
    of integrating all components on a single-crystal silicon wafer, which led to small-scale integration (SSI) in the early 1960s, and then medium-scale integration...
    15 KB (1,599 words) - 03:19, 10 October 2024
  • Thumbnail for STMicroelectronics
    currently part of the Analog MEMS and Sensors business group; In 2000, WaferScale Integration Inc. (WSI, Fremont, California), a vendor of EPROM and flash memory-based...
    38 KB (4,088 words) - 01:29, 20 October 2024
  • College, Cambridge. Catt developed and patented some ideas on Wafer scale integration (WSI) in 1972, and published his work in Wireless World in 1981...
    9 KB (997 words) - 20:46, 30 July 2024
  • Thumbnail for Cerebras
    Eclipse. On August 19, 2019, Cerebras announced its first-generation Wafer-Scale Engine (WSE).’ In November 2019, Cerebras closed its series E round with...
    36 KB (3,629 words) - 18:30, 1 November 2024
  • technologies developed by the main company. These included Anamartic Ltd (wafer-scale integration), Shaye Communications Ltd (CT2 mobile telephony) and Cambridge...
    30 KB (3,122 words) - 18:00, 22 October 2024
  • problem by producing all of the circuit boards on a single wafer, known as wafer scale integration (WSI). Instead of making many small boards and wiring them...
    9 KB (1,134 words) - 04:06, 16 October 2024
  • Thumbnail for Custom hardware attack
    since the communication requirements for the chips are the same. Wafer-scale integration is another possibility. The primary limitations on this method...
    6 KB (684 words) - 01:53, 29 August 2024
  • Thumbnail for Quantum computing
    Technologically these devices are all cryogenic and scaling to large numbers of qubits requires wafer-scale integration, a serious engineering challenge by itself...
    115 KB (12,556 words) - 21:31, 24 October 2024
  • later went to work for a number of startups, including Synertek, Wafer Scale Integration and San Disk. He and Sanjay Mehrotra co-founded SanDisk in 1988...
    3 KB (233 words) - 18:39, 15 July 2024
  • the design, modeling, and applications of multi-chip modules and wafer-scale integration. It was established in 1999 and ceased publication in 2010. The...
    2 KB (98 words) - 03:54, 31 July 2024
  • Thumbnail for Clive Sinclair
    technologies developed by the company. These included Anamartic Ltd. (wafer-scale integration) and Cambridge Computer Ltd. (Z88 portable computer and satellite...
    45 KB (4,788 words) - 18:20, 24 October 2024
  • general, 3D integration is a broad term that includes such technologies as 3D wafer-level packaging (3DWLP); 2.5D and 3D interposer-based integration; 3D stacked...
    81 KB (8,773 words) - 01:41, 24 October 2024
  • Thumbnail for Brilliant Pebbles
    The idea of using an entire wafer for a single computer processor was in vogue at the time, see wafer scale integration. The worst-case scenario was...
    54 KB (7,710 words) - 18:29, 13 August 2024
  • Thumbnail for Embedded wafer level ball grid array
    Embedded wafer level ball grid array (eWLB) is a packaging technology for integrated circuits. The package interconnects are applied on an artificial wafer made...
    5 KB (656 words) - 16:32, 23 June 2024
  • Thumbnail for Multi-project wafer service
    multi-project wafer (MPW) semiconductor manufacturing arrangements allow customers to share tooling (like mask) and microelectronics wafer fabrication cost...
    19 KB (2,004 words) - 21:39, 11 August 2024
  • Thumbnail for Die (integrated circuit)
    a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (diced)...
    5 KB (462 words) - 23:58, 25 October 2024
  • Thumbnail for List of electronic component packaging types
    other three-dimensional integrated circuits Multi-chip module WSI (wafer-scale integration) Proximity communication Surface-mount components are usually smaller...
    62 KB (3,396 words) - 21:48, 26 October 2024
  • The acronym WSI may refer to: Wafer-scale integration, a technique for building large integrated circuits Wall Street Institute, the former name of Wall...
    2 KB (240 words) - 08:13, 28 March 2023
  • Thumbnail for Perovskite solar cell
    sustainable technique for medium scale manufacturing, for instance, for standalone modules or Si wafer-scale integration. This work shows that through judicious...
    185 KB (20,955 words) - 19:36, 6 September 2024
  • Thumbnail for Semiconductor device fabrication
    of wafers from machine to machine. A wafer often has several integrated circuits which are called dies as they are pieces diced from a single wafer. Individual...
    109 KB (11,548 words) - 07:14, 16 October 2024
  • Thumbnail for Etching (microfabrication)
    from the surface of a wafer during manufacturing. Etching is a critically important process module in fabrication, and every wafer undergoes many etching...
    17 KB (1,558 words) - 09:49, 28 May 2024
  • Thumbnail for Through-silicon via
    vertical electrical connection (via) that passes completely through a silicon wafer or die. TSVs are high-performance interconnect techniques used as an alternative...
    15 KB (1,733 words) - 14:36, 22 May 2024
  • Thumbnail for Book embedding
    18.7, p. 405. Rosenberg, Arnold L. (1986), "Book embeddings and wafer-scale integration", Proceedings of the seventeenth Southeastern international conference...
    68 KB (8,167 words) - 00:16, 5 October 2024
  • Thumbnail for TSMC
    TSMC (redirect from WaferTech)
    production to TSMC. At least one semiconductor company, LSI, re-sells TSMC wafers through its ASIC design services and design IP portfolio.[dubious – discuss]...
    95 KB (7,542 words) - 16:32, 1 November 2024
  • they are still part of the wafer wafer-to-wafer (also wafer-on-wafer) stacking – bonding and integrating whole processed wafers atop one another before dicing...
    14 KB (1,689 words) - 11:55, 18 October 2023
  • Very-large-scale integration (VLSI) lithography uses projection systems. Unlike contact or proximity masks, which cover an entire wafer, projection masks...
    58 KB (6,445 words) - 02:12, 12 September 2024
  • semiconductor wafer. Process corners represent the extremes of these parameter variations within which a circuit that has been etched onto the wafer must function...
    7 KB (923 words) - 17:12, 9 June 2024