A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular...

BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern which, in operation...

The land grid array (LGA) is a type of surface-mount packaging for integrated circuits (ICs) that is notable for having the pins on the socket (when a...

or columns arranged in a grid pattern. The body of the component is ceramic. Lead-less package (LLP): A package with metric pin distribution (0.5 mm pitch)...

first area array package was a ceramic pin grid array package. Not long after, the plastic ball grid array (BGA), another type of area array package, became...

Socket A (also known as Socket 462) is a zero insertion force pin grid array (PGA) CPU socket used for AMD processors ranging from the Athlon Thunderbird...

incompatible with 939 motherboards and vice versa, and although it has 940 pins, it is incompatible with Socket 940. Socket AM2 supports DDR2 SDRAM memory...

of wiring. It is packaged in a 36 mm by 36 mm ceramic pin grid array module which had 201 signal pins. It required a 3.6 volt power supply and consumed...

process and alignment of parts during assembly. The later pin grid array (PGA) and ball grid array (BGA) packages, by allowing connections to be made over...

respectively) Pin grid array (PGA) packages may be considered to have evolved from the DIP. PGAs with the same 0.1 inches (2.54 mm) pin centers as most...

metal–oxide–semiconductor (CMOS) process. The PA-7100 is packaged in a 504-pin ceramic pin grid array that has a copper-tungsten heat spreader. An improved PA-7100...

in a 179-pin ceramic pin grid array (CPGA). The R4000SC and R4000MC are packaged in a 447-pin ceramic staggered pin grid array (SPGA). The pin out of the...

CPGA may stand for: Ceramic pin grid array, a kind of a package for integrated circuits Cornish Pilot Gig Association This disambiguation page lists articles...

memory controller The pin configuration of the AM2+ socket (940 pins) is mechanically different from the AM3 socket (941 pins) The 4 holes for fastening...

transistors on a 0.595 by 0.586 inch die packaged in a custom 339-pin ceramic pin grid array (CPGA). The system supported a maximum of 1 GB of memory. Computergram...

(JIAWG) 32-bit ISA standard. It was originally packaged in a 348 lead ceramic pin grid array and later supplied as a bare die. The i960 MX supports object-oriented...

interconnect. It was packaged in a 179-pin ceramic pin grid array that was compatible with the R4x00PC and R4600, or a 208-pin plastic quad flat pack (PQFP)....

three-level metal CMOS26B process. The PA-7100LC is packaged in a 432-pin ceramic pin grid array. The PA-7300LC was a further development of the PA-7100LC. It...

was packaged in a 527-pin ceramic pin grid array (CPGA); and that vendors also investigated the possibility of using a 339-pin multi-chip module (MCM)...

was packaged in a 272-ball plastic ball grid array (BGA) or 223-pin ceramic pin grid array (PGA). It was not pin-compatible with any previous MIPS microprocessor...

with the suppressor grid wired internally to the cathode (e.g. EL84/6BQ5) and those with the suppressor grid wired to a separate pin for user access (e...

interconnect. The chips are packaged in ceramic pin grid array (CPGA) packages that can have up to 300 pins and dissipate a maximum of 4 W of heat each...

metal–oxide–semiconductor (CMOS) process. Both are packaged in 591-pin ceramic pin grid array (CPGA) packages. Both chips used a 3.3 V power supply, and the...

is 9.02 × 9.02 mm large (81.36 mm2). Both are packaged in 135-pin ceramic pin grid arrays. A CMOS version of the ROMP and Rosetta (called ROMP-C and Rosetta-C)...

prior to deposition on the array surface and are then "spotted" onto glass. A common approach utilizes an array of fine pins or needles controlled by a...

suppressor grid on pin 4, an internal shield on pin 5, and the cathode on pin 7 7W7 – Sharp-cutoff pentode; 7V7 but with the suppressor grid and internal...

The 21064 is packaged in a 431-pin alumina-ceramic pin grid array (PGA) measuring 61.72 mm by 61.72 mm. Of the 431 pins, 291 were for signals and 140 were...

Motorola offered the XC157, a mask-programmed gate array with 12 gates and 30 uncommitted input/output pins. In 1970, Texas Instruments developed a mask-programmable...

programmable logic devices (PLDs). They consist of an array of programmable logic blocks with a connecting grid, that can be configured "in the field" to interconnect...

0–16.78 MHz or 0–25.16 MHz Operation 144-Pin Ceramic Quad Flat Pack (CQFP) or 145-Pin Plastic Pin Grid Array (PGA) Available in 3.3 and 5V The MC68340...