die shrink (sometimes optical shrink or process shrink) refers to the scaling of metal–oxide–semiconductor (MOS) devices. The act of shrinking a die creates...

the memory controller into the CPU die. Added important powerful new instructions, SSE4.2. Westmere: 32 nm shrink of the Nehalem microarchitecture with...

In semiconductor manufacturing, the 3nm process is the next die shrink after the 5 nm MOSFET (metal–oxide–semiconductor field-effect transistor) technology...

process is a half-node semiconductor manufacturing process based on a die shrink of the "32 nm" lithography process. It appeared in production in 2010...

the "fourth-generation core" successor to the Ivy Bridge (which is a die shrink/tick of the Sandy Bridge microarchitecture). Intel officially announced...

continued its tick-tock model of a microarchitecture change followed by a die shrink until the 6th-generation Core family based on the Skylake microarchitecture...

Core processors based on Palm Cove, a 10 nm die shrink of the Kaby Lake microarchitecture. As a die shrink, Palm Cove is a new process in Intel's...

soldered contact with the die and IHS (Integrated Heat Spreader), while Intel's subsequent generation Ivy Bridge uses a 22 nm die shrink and a TIM (Thermal Interface...

itself, beginning with memory and graphics controllers. Since the 2010s, die shrink and improved transistor density have allowed for increasing chipset integration...

is the next MOSFET (metal–oxide–semiconductor field-effect transistor) die shrink after the 3 nm process node. The term "2 nanometer", or alternatively...

disturbing Moore's law. The 20-nanometre node is an intermediate half-node die shrink based on the 22-nanometre process. TSMC began mass production of 20 nm...

Skymont) is Intel's codename for the 10-nanometer die shrink of the Kaby Lake microarchitecture. As a die shrink, Cannon Lake is a new process in Intel's...

Family 15h (3rd-gen) – third-generation Bulldozer (Second optimisation and die shrink to 28 nm). CPUID model numbers are 30h-3Fh. AMD Excavator Family 15h (4th-gen)...

the Intel Core processor. It is Intel's codename for the 14 nanometer die shrink of its Haswell microarchitecture. It is a "tick" in Intel's tick–tock...

technology 3.0–3.6 GHz (model numbers 6x1) Introduced January 16, 2006 Die shrink of Prescott-2M Same features as Prescott-2M Family 15 Model 4 Dual-core...

retaining some of the latter's minor features. Nehalem later received a die-shrink to 32 nm with Westmere, and was fully succeeded by "second-generation"...

Under this model, every microarchitecture change (tock) was followed by a die shrink of the process technology (tick). It was replaced by the...

Shrinking is an American comedy drama television series created by Bill Lawrence, Jason Segel, and Brett Goldstein. The series stars Segel as a grieving...

the desktop Clarkdale processor; both use dual-core dies based on the Westmere 32 nm die shrink of the Nehalem microarchitecture, and have integrated...

generation of the Intel Core processors (Core i7, i5, i3). Ivy Bridge is a die shrink to 22 nm process based on FinFET ("3D") Tri-Gate transistors, from the...

Westmere (formerly Nehalem-C) is the code name given to the 32 nm die shrink of Nehalem. While sharing the same CPU sockets, Westmere included Intel HD...

thirty-two nanometers. The "28 nm" node is an intermediate half-node die shrink based on the "32 nm" process. The "32 nm" process was superseded by commercial...

announced in 1H14. According to the Tick–tock model Airmont is the 14 nm die shrink of Silvermont, launched in early 2015 and first seen in the Atom x7-Z8700...

The CD2801/Die revision F fixes an interpolator bug. TMS5100A: Die shrink of TMS5100/TMC0281. Very minor differences in function, uses die rev F, fixing...

2016. Under this three-phase (three-year) model, every microprocessor die shrink is followed by a microarchitecture change and then by one or more optimizations...

minimum sizes and tighter spacing. In some cases, this allows a simple die shrink of a currently produced chip design to reduce costs, improve performance...

process permitting 180-nanometer processor production. The accompanying die-shrink resulted in lower power consumption, permitting AMD to increase Athlon...

series), for both the base and digital versions of the PS5, which used a die shrink of the original SoC. This lowered the power draw of the SoC and Sony redesigned...

have TV input. PCI Millennium G200A Calao 250 nm 84 112 1×1 No 64-bit Die-shrink G200. "LE" max 8 MB SDRAM. 250 MHz RAMDAC. No heatsink. Power Consumption...

processor continued an emphasis on minimizing power consumption with the next die shrink to a mixed 130/150 nm process. "Ezra" (C5C) and "Ezra-T" (C5N) were only...