Integrated circuit (redirect from IC chip)
An integrated circuit (IC), also known as a microchip, computer chip, or simply chip, is a small electronic device made up of multiple interconnected electronic...
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The first planar monolithic integrated circuit (IC) chip was demonstrated in 1960. The idea of integrating electronic circuits into a single device was...
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Random-access memory (redirect from RAM IC)
today's technology, random-access memory takes the form of integrated circuit (IC) chips with MOS (metal–oxide–semiconductor) memory cells. RAM is normally...
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development of transistors in the 1950s and then the integrated circuit (IC) approach which followed. The MOSFET was invented at Bell Labs between 1955...
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Power semiconductor device (redirect from Power IC)
also called a power device or, when used in an integrated circuit, a power IC. A power semiconductor device is usually used in "commutation mode" (i.e....
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logic functions. CMOS technology is used for constructing integrated circuit (IC) chips, including microprocessors, microcontrollers, memory chips (including...
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was a hybrid integrated circuit (hybrid IC), rather than a monolithic integrated circuit (IC) chip. Kilby's IC had external wire connections, which made...
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IC train had commercial name. All IC trains are named by natural monuments (IC Tatran, IC Kriváň, IC Gerlach, IC Rysy, IC Chopok, IC Ďumbier). All IC...
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multi-core processor (MCP) is a microprocessor on a single integrated circuit (IC) with two or more separate central processing units (CPUs), called cores to...
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of the cores of larger stars. They are the remnant of supernova types Ib, Ic, and II. Neutron stars are expected to have a skin or "atmosphere" of normal...
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(geometrical location and search, route planning), integrated circuit design (IC geometry design and verification), computer-aided engineering (CAE) (mesh...
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Class 1293 Vectron ÖBB Class 1016/1116/1216 Taurus ÖBB Class 1144 ÖBB Class 1142 ÖBB Class 1163 ÖBB Class 1063 ÖBB Class 2016 Hercules ÖBB Class 2143 ÖBB...
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value. In most cases a comparator is implemented using a dedicated comparator IC, but op-amps may be used as an alternative. Comparator diagrams and op-amp...
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integrated circuit (IC) chip was proposed by applications engineer Bob Norman at Fairchild Semiconductor. The first single-chip memory IC was the BJT 16-bit...
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astronomical objects May actually be UGC 2119 (02h 37m 58.7s, −01° 50′ 39″) or IC 243 (02h 38m 32.2s, −06° 54′ 07″) Thought to be an open cluster Gaia data...
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IEEE Fellow known for his contributions to low-power Integrated Circuit (IC) design. Yeo attended Nanyang Technological University (NTU), Singapore and...
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1020 LDN 1066 LDN 1073 LDN 1083 LDN 1105 LDN 1109 LDN 1139 LDN 1141 LDN 1142 LDN 1150 LDN 1153,LDN 1143,and LDN 1151 are a part of Barnard 169. LDN 1206...
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International Journal of High Speed Electronics and Systems. 14 (3): 791–796. doi:10.1142/S0129156404002843. ISSN 0129-1564. Meneghini, Matteo; De Santi, Carlo; Abid...
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Physics Letters A. 31 (36): 1675002. Bibcode:2016MPLA...3175002L. doi:10.1142/S021773231675002X. Markevitch, M.; Randall, S.; Clowe, D.; Gonzalez, A. &...
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Surface Device". Technical Memorandum of Bell Laboratories: 583–596. doi:10.1142/9789814503464_0076. ISBN 978-981-02-0209-5. Lojek, Bo (2007). History of...
99 KB (11,953 words) - 23:36, 19 October 2024
IC (1937–1966), p. 23, Vol. V. IC (1937–1966), pp. 69, Vol. II. ISCC (1893), pp. 21–26. IC (1937–1966), pp. 5–6, Vol. V. MEC (2007), pp. 47–53. IC (1937–1966)...
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Congress on Mathematical Physics. World Scientific. pp. 415–422. doi:10.1142/9789812704016_0039. ISBN 978-981-256-201-2. Gibbs, Josiah Willard (1902)...
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Kiel — Fulda — Basel — Chur IC 30: (Westerland/Flensburg/Greifswald —) Hamburg — Cologne — Mannheim — Basel — Zürich IC 32: Münster/Dortmund — Stuttgart...
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Surface Device". Technical Memorandum of Bell Laboratories: 583–596. doi:10.1142/9789814503464_0076. ISBN 978-981-02-0209-5. Lojek, Bo (2007). History of...
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and clusters in the supercluster include the NGC 6769 Group and Abell S805 (IC 4765 Group, Pavo II, DRCG 1842-63) and the massive Norma Cluster. In 2014...
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Ben-Naim A, Ben-Naim R, et al. (2011). Alice's Adventures in Water-land. doi:10.1142/8068. ISBN 978-981-4338-96-7. Matsuoka N, Murton J (2008). "Frost weathering:...
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integrated circuit (3D IC) technology stacks integrated circuit (IC) chips vertically into a single 3D IC chip package. Toshiba introduced 3D IC technology to...
188 KB (17,261 words) - 06:00, 14 October 2024
Surface Device". Technical Memorandum of Bell Laboratories: 583–596. doi:10.1142/9789814503464_0076. ISBN 978-981-02-0209-5. Lojek, Bo (2007). History of...
25 KB (2,791 words) - 03:11, 29 September 2024