List of Qualcomm Snapdragon systems on chips
General information | |
---|---|
Launched | 2007 |
Designed by | Qualcomm |
Architecture and classification | |
Application | Mobile SoC and 2-in-1 PC |
Microarchitecture | ARM9, ARM11, ARM Cortex-A, Cortex-X1, Cortex-X2, Cortex-X3, Cortex-X4, Scorpion, Krait, Kryo, Oryon |
Instruction set | ARMv6, ARMv7-A, ARMv8-A, ARMv9-A |
Physical specifications | |
Cores |
|
This is a list of Qualcomm Snapdragon systems on chips (SoC) made by Qualcomm for use in smartphones, tablets, laptops, 2-in-1 PCs, smartwatches, and smartbooks devices.
Before Snapdragon
SoC made by Qualcomm before it was renamed to Snapdragon.[1]
Model number | Fab | CPU | GPU (or Gfx Core) | Connectivity | Sampling availability |
---|---|---|---|---|---|
QSC1xxx | |||||
QSC1100 | Q4 2007 | ||||
QSC6xxx | |||||
QSC6010 | ARMv5TEJ ARM926EJ-S[citation needed] | No 3D and ARM 2D | None | 2006 | |
QSC6020 | |||||
QSC6030 | |||||
QSC6240 | HSDPA | Q3 2007 | |||
QSC6245-1 | HSDPA | Q3 2007 | |||
QSC6055 | Q1 2007 | ||||
QSC6065 | HSDPA | Q2 2007 | |||
QSC6260-1 | Q3 2007 | ||||
QSC6270 | HSDPA | ||||
QSC6075 | Q2 2007 | ||||
QSC6085 | DOrA | Q4 2007 | |||
MSM6xxx | |||||
MSM6000 | None | 2006 | |||
MSM6025 | |||||
MSM6050 | |||||
MSM6100 | ARM-DSP 3D and ARM 2D | ||||
MSM6125 | |||||
MSM6150 | Defender2 3D and ARM 2D | ||||
MSM6175 | |||||
MSM6225 | No 3D and ARM 2D | HSDPA | |||
MSM6250 | ARM-DSP 3D and ARM 2D | WCDMA | 2006 | ||
MSM6250A | No 3D and ARM 2D | WCDMA | |||
MSM6245 | WEDGE | ||||
MSM6255A | |||||
MSM6260 | ARMv5TEJ ARM926EJ-S @ 225 MHz[2] | ARM-DSP 3D and ARM 2D | HSUPA | ||
MSM6275 | Defender2 3D and ARM 2D | ||||
MSM6280 | |||||
MSM6280A | Stargate 3D and ARM 2D | 2007 | |||
MSM6800A | Defender3 3D and ARM 2D | DOrA | 2006 | ||
MSM6575 | DOr0 | ||||
MSM6550 | ARMv5TEJ ARM926EJ-S @ 225 MHz[3] | Defender2 3D and ARM 2D | |||
MSM6550A | |||||
MSM6800 | DOrA | ||||
MSM6500 | ARMv5TEJ ARM926EJ-S @ 150 MHz[4] | ARM-DSP 3D and ARM 2D | DOr0 | ||
MSM7xxx | |||||
MSM7200 | Imageon 3D Imageon 2D | HSUPA | 2006 | ||
MSM7200A | ARM11 @ 528 MHz | Q1 2007 | |||
MSM7201[5][6] | 2008 | ||||
MSM7500 | DOrA | 2006 | |||
MSM7500A | Q4 2007 | ||||
MSM7600 | 65 nm | ARM1136J-S @ 528 MHz[5][6] | HSUPA and DOrA | Q1 2007 | |
MSM7850 | LT 3D and LT 2D | DOrB | 2008 |
Snapdragon S series
Snapdragon S1 notable features over its predecessor (MSM7xxx):
- CPU features
- GPU features
- Adreno 200 (From Software rendered or Adreno 130)
- OpenGL ES 1.1
- OpenVG 1.0
- Direct3D Mobile
- Unified shader model 5-way VLIW
- Adreno 200 (From Software rendered or Adreno 130)
- DSP features
- ISP features
- Up to 12 MP camera
- Modem and wireless features
- 45 or 65 nm manufacturing technology[7]
Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
MSM7225[8] | 65 nm | 1 core up to 528 MHz ARM11 (ARMv6): 16K+16K L1 cache, no L2 cache | Software rendered 2D support (HVGA) | Hexagon QDSP5 320 MHz | Up to 5 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | UMTS (HSPA); GSM (GPRS, EDGE) | Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen 7; USB 2.0 | 2007 |
MSM7625[8] | CDMA (1× Rev. A, 1×EV-DO Rev. A); UMTS; GSM | ||||||||
MSM7227[8] | 1 core up to 800 MHz ARM11 (ARMv6): 16K+16K L1 cache, 256K L2 cache | Adreno 200 226 MHz (FWVGA) | Up to 8 MP camera | LPDDR Single-channel 166 MHz (1.33 GB/s) | UMTS; GSM | Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 | 2008 | ||
MSM7627[8] | CDMA/UMTS; GSM | ||||||||
MSM7225A[8] | 45 nm | 1 core up to 800 MHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache | Adreno 200 245 MHz (HVGA) | Hexagon QDSP5 350 MHz | Up to 5 MP camera | LPDDR Single-channel 200 MHz (1.6 GB/s) | UMTS (HSDPA, HSUPA, W-CDMA), MBMS; GSM | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 | Q4 2011 |
MSM7625A[8] | CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM | ||||||||
MSM7227A[8] | 1 core up to 1 GHz Cortex-A5 (ARMv7): 32K+32K L1 cache, 256K L2 cache | Adreno 200 245 MHz (FWVGA) | Up to 8 MP camera | UMTS, MBMS; GSM | |||||
MSM7627A[8] | CDMA2000/UMTS, MBMS; GSM | ||||||||
MSM7225AB[8][9][10] | UMTS: up to 7.2 Mbit/s, MBMS; GSM | ||||||||
QSD8250[8] | 65 nm | 1 core up to 1 GHz Scorpion (ARMv7): 32K+32K L1 cache, 256K L2 cache | Adreno 200 226 MHz (WXGA) | Hexagon QDSP6 600 MHz | Up to 12 MP camera | LPDDR Single-channel 400 MHz | UMTS, MBMS; GSM | Bluetooth 2.0/2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 | Q4 2008 |
QSD8650[8] | CDMA2000/UMTS, MBMS; GSM |
Snapdragon S2 notable features over its predecessor (Snapdragon S1):
- CPU feature
- GPU features
- Memory features
- Up to LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)
- DSP features
- Hexagon QDSP5 at 256 MHz
- 45 nm manufacturing technology
- 904 pins[14]
Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
MSM7230[8] | 45 nm | 1 core up to 800 MHz Scorpion: 32K+32K L1, 256K L2 | Adreno 205 266 MHz (XGA) | Hexagon QDSP5 256 MHz | Up to 12 MP camera | LPDDR2 32 bit Dual-channel 333 MHz (5.3 GB/s)[15] | UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) | Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 | Q2 2010 |
MSM7630[8] | CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM | ||||||||
APQ8055[8] | 1 core up to 1.4 GHz Scorpion: 32K+32K L1, 384K L2 | — | |||||||
MSM8255[8] | 1 core up to 1 GHz Scorpion: 32K+32K L1, 384K L2 | UMTS, MBMS; GSM | |||||||
MSM8655[8] | CDMA2000/UMTS, MBMS; GSM | ||||||||
MSM8255T[8] | 1 core up to 1.5 GHz Scorpion: 32K+32K L1, 384K L2 | UMTS, MBMS; GSM | |||||||
MSM8655T[8] | CDMA2000/UMTS, MBMS; GSM |
Snapdragon S3 notable features over its predecessor (Snapdragon S2):
- CPU feature
- 2 cores up to 1.7 GHz Scorpion
- 512 KB L2
- GPU features
- DSP features
- ISP features
- Up to 16 MP camera (From 12 MP)
- 45 nm manufacturing technology
Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
APQ8060[8] | 45 nm | 2 cores up to 1.7 GHz Scorpion: 512 KB L2 | Adreno 220 266 MHz (WXGA+) | Hexagon QDSP6 400 MHz | Up to 16 MP camera | LPDDR2 Single-channel 333 MHz (2.67 GB/s)[17] | — | Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with GLONASS; USB 2.0 | 2011 |
MSM8260[8] | UMTS (HSDPA, HSUPA, HSPA+, W-CDMA), MBMS; GSM (GPRS, EDGE) | Q3 2010 | |||||||
MSM8660[8] | CDMA2000 (1×Adv,[16] 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSM |
Snapdragon S4 is offered in three models; S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices.[18] It was launched in 2012.
The Snapdragon S4 were succeeded by Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro)
Snapdragon S4 Play
Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
MSM8225[18] | 45 nm | 2 cores up to 1.2 GHz Cortex-A5: 2x 32K+32K L1, 512K L2 | Adreno 203 320 MHz (FWVGA) | Hexagon | Up to 8 MP camera | LPDDR2 Single-channel 300 MHz | UMTS (HSPA); GSM (GPRS, EDGE) | Bluetooth 3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 | 1H 2012 |
MSM8625[18] | CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS; GSM |
Snapdragon S4 Plus
Snapdragon S4 plus notable features over its predecessor (Snapdragon S3):
- CPU features
- GPU features
- Adreno 225
- Adreno 305
- Up to 1080p screen (on 400 MHz)
- Up to 720p screen (on 320 MHz)
- Up to 24 ALU (From 32 on S3)
- Unified shader model Scalar instruction set (From Unified shader model 5-way VLIW)
- Up to x8 relative performance on OpenGL ES 2.0 from Adreno 200[12]
- DSP features
- Up to 20 MP or 13.5 MP camera
- ISP features
- Hexagon QDSP6
- Modem and wireless features
- 28 nm manufacturing technology
Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
MSM8227[18] | 28 nm | 2 cores up to 1 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 320 MHz (FWVGA / 720p) | Hexagon QDSP6 | LPDDR2 Single-channel 400 MHz | UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | 2H 2012 | |
MSM8627[18] | CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS; GSM | ||||||||
APQ8030[18] | 2 cores up to 1.2 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 305 400 MHz (qHD / 1080p) | Up to 13.5 MP camera | LPDDR2 Single-channel 533 MHz | — | 3Q 2012 | |||
MSM8230[18] | UMTS; GSM | ||||||||
MSM8630[18] | CDMA/UMTS; GSM | ||||||||
MSM8930[18] | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA/UMTS; GSM) | ||||||||
APQ8060A[18] | 2 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 225 400 MHz (WUXGA / 1080p) | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | — | 2H 2012 | |||
MSM8260A[18] | UMTS; GSM | Q1 2012 | |||||||
MSM8660A[18] | CDMA/UMTS; GSM | ||||||||
MSM8960[18][20] | World Mode (LTE Cat 3) |
Snapdragon S4 Pro and Snapdragon S4 Prime (2012)
Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play):
- CPU features
- GPU features
- Adreno 320
- Support OpenGL ES 3.0
- Up to 1080p screen
- Up to 64 ALU (From 32 on S4 plus)
- Up to x23 relative performance on OpenGL ES 2.0 from Adreno 200[12]
- Adreno 320
- DSP features
- Hexagon QDSP6
- ISP features
- Up to 20 MP camera
- Modem and wireless features
- LTE FDD/TDD Cat 3 or external on some models
- 28 nm LP manufacturing technology
- Up to eMMC 4.4/4.4.1
Model number | Fab | CPU (ARMv7) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
MSM8260A Pro[18] | 28 nm (TSMC 28LP) | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 | Adreno 320 400 MHz (WUXGA / 1080p) | Hexagon QDSP6 | Up to 20 MP camera | LPDDR2 Dual-channel 500 MHz | UMTS (DC-HSPA+, TD-SCDMA); GSM (GPRS, EDGE) | Bluetooth 4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 | |
MSM8960T[18] | World Mode (LTE FDD/TDD Cat 3, SVLTE-DB, EGAL; CDMA: 1× Adv., 1× EV-DO Rev. A/B; UMTS; GSM) | Q2 2012 | |||||||
MSM8960T Pro (MSM8960AB[21])[18] | |||||||||
MSM8960DT[18][22] | 2 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2; natural language processor and contextual processor | Q3 2013 | |||||||
APQ8064[18][20] | 4 cores up to 1.5 GHz Krait: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz (QXGA / 1080p) | LPDDR2 Dual-channel 533 MHz[23] | External | 2012 |
Snapdragon 2 Series
The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.
Snapdragon 200 series (2013–2019)
The Snapdragon 200 was announced in 2013.
The Snapdragon 208 and Snapdragon 210 were announced on September 9, 2014.[24]
The Snapdragon 212 was announced on July 28, 2015.[25]
The Qualcomm 205 Mobile Platform formally falls under the Mobile Platform brand, but is practically a Snapdragon 208 with a X5 LTE modem. It was announced March 20, 2017.[26]
The Qualcomm 215 was announced on July 9, 2019.[27] It is a toned-down variant of the Snapdragon 425 and primarily optimized for Android Go Edition devices.
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
MSM8225Q[28] | Snapdragon 200 | 45 nm (TSMC 45LP) | 4 cores up to 1.4 GHz Cortex-A5 | Adreno 203 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP5 | Up to 8 MP single camera | LPDDR2 Single-channel 333 MHz | Gobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) | Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 | — | 2013 |
MSM8625Q[28] | Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM) | ||||||||||
MSM8210[28][29] | 28 nm (TSMC 28LP) | 2 cores up to 1.2 GHz Cortex-A7 | Adreno 302 400 MHz (12.8 GFLOPS in FP32) | Hexagon QDSP6 | Gobi 3G (UMTS; GSM) | ||||||
MSM8610[28][29] | Gobi 3G (CDMA/UMTS; GSM) | ||||||||||
MSM8212[28][29] | 4 cores up to 1.2 GHz Cortex-A7 | Gobi 3G (UMTS; GSM) | |||||||||
MSM8612[28][29] | Gobi 3G (CDMA/UMTS; GSM) | ||||||||||
MSM8905[30] | Qualcomm 205 | 2 cores up to 1.1 GHz Cortex-A7 | Adreno 304 400 MHz (19.2 GFLOPS in FP32) | Hexagon 536 | Up to 3 MP single camera | LPDDR2/3 Single-channel 384 MHz | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) | 4.0 | 2017 | |
MSM8208[31] | Snapdragon 208 | Up to 5 MP single camera | LPDDR2/3 Single-channel 400 MHz | Gobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) | 2.0 | 2014 | |||||
MSM8909[32] | Snapdragon 210 | 4 cores up to 1.1 GHz Cortex-A7 | Up to 8 MP single camera | LPDDR2/3 Single-channel 533 MHz | X5 LTE | ||||||
MSM8909AA[33] | Snapdragon 212 | 4 cores up to 1.3 GHz Cortex-A7 | 2015 | ||||||||
QM215[34] | Qualcomm 215 | 4 cores up to 1.3 GHz Cortex-A53 | Adreno 308 485 MHz (23.3 GFLOPS in FP32) | Hexagon | Up to 13 MP single camera / 8 MP dual camera | LPDDR3 Single-channel 672 MHz 3 GB | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 | 1.0 | Q3 2019 |
Snapdragon 4 Series
The Snapdragon 4 Series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 Series, which were aimed at ultra-budget segment. Similar to the 2 Series, it is the successor of the S4 Play.
Snapdragon 400 series (2013–2021)
The Snapdragon 400 was announced in 2013.
The Snapdragon 410 was announced on December 9, 2013.[35] It was Qualcomm's first 64-bit mobile system on a chip and first manufactured in China by SMIC.[36]
The Snapdragon 412 was announced on July 28, 2015.[25]
The Snapdragon 415 and the older Snapdragon 425 (later cancelled) were announced on February 18, 2015.[37]
Snapdragon 425, 427, 430 and 435 are pin and software compatible; software compatible with Snapdragon 429, 439, 450, 625, 626 and 632.
The Snapdragon 430 was announced on September 15, 2015.[38]
The new Snapdragon 425 and Snapdragon 435 were announced on February 11, 2016.[39]
The Snapdragon 427 was announced on October 18, 2016.[40][41]
The Snapdragon 450 was announced on June 28, 2017.[42] Pin and software compatible with Snapdragon 625, 626 and 632; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 429 and 439 were announced on June 26, 2018.[43] Snapdragon 429 and 439 pin and software compatibility; software compatible with Snapdragon 425, 427, 430, 435, 450, 625, 626 and 632.
The Snapdragon 460 was announced on 20 January 2020, with NavIC support. It is the first Snapdragon 400 model to incorporate the Kryo architecture.[44]
The Snapdragon 480 was announced on January 4, 2021, and is the first SoC in the Snapdragon 4-Series by Qualcomm to support 5G Connectivity.[45]
The Snapdragon 480+ was announced on October 26, 2021.[46]
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
APQ8026[47] | Snapdragon 400 | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | Hexagon QDSP6 | Up to 13.5 MP single camera | LPDDR2/3 Single-channel 533 MHz | — | Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS | 1.0 | 2013 |
MSM8226[47] | Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE) | ||||||||||
MSM8626[47] | Gobi 3G (CDMA/UMTS) | ||||||||||
MSM8926[47] | Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | ||||||||||
APQ8028[47] | 4 cores up to 1.6 GHz Cortex-A7: 32 KB L1, 512 KB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | — | ||||||||
MSM8228[47] | Gobi 3G (UMTS) | ||||||||||
MSM8628[47] | Gobi 3G (CDMA/UMTS) | ||||||||||
MSM8928[47] | Gobi 4G (LTE Cat 4) | ||||||||||
MSM8230[47] | 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 | Adreno 305 400 MHz (19.2 GFLOPS in FP32) | LPDDR2 Single-channel 533 MHz | Gobi 3G (UMTS) | |||||||
MSM8630[47] | Gobi 3G (CDMA/UMTS) | ||||||||||
MSM8930[47] | Gobi 4G (LTE Cat 4) | ||||||||||
MSM8930AA[47] | 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 | Gobi 4G (LTE Cat 4) | |||||||||
APQ8030AB[47] | 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 | Adreno 305 450 MHz (21.6 GFLOPS in FP32) | — | ||||||||
MSM8230AB[47] | Gobi 3G (UMTS) | ||||||||||
MSM8630AB[47] | Gobi 3G (CDMA/UMTS) | ||||||||||
MSM8930AB[47] | Gobi 4G (LTE Cat 4) | ||||||||||
APQ8016 | Snapdragon 410 | 28 nm (TSMC 28LP) / 28 nm (SMIC) | 4 cores up to 1.2 GHz Cortex-A53 | Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32) | Hexagon QDSP6 V5 | LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) | — | Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou | 2.0 | H1 2014 | |
MSM8916[48] | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | ||||||||||
MSM8916 v2[49] | Snapdragon 412 | 28 nm (TSMC 28LP) | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 306 450 MHz (21.6 GFLOPS in FP32) | LPDDR2/3 Single-channel 32-bit 600 MHz (4.8 GB/s) | H2 2015 | |||||
MSM8929[50] | Snapdragon 415 | 4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53) | Adreno 405 465 MHz (44.6 GFLOPS in FP32) | Hexagon V50 | Up to 13 MP single camera | LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s) | Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS | H1 2015 | |||
MSM8917[51] | Snapdragon 425 | 4 cores up to 1.4 GHz Cortex-A53 | Adreno 308 598 MHz (28.7 GFLOPS in FP32) | Hexagon 536 | Up to 16 MP single camera | X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) | Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C | Q3 2016 | |||
MSM8920[52] | Snapdragon 427 | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | 3.0 | Q1 2017 | |||||||
MSM8937[53] | Snapdragon 430 | 4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53) | Adreno 505 450 MHz (43.2 GFLOPS in FP32) | Up to 21 MP single camera | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X6 LTE | Q2 2016 | ||||
MSM8940[54] | Snapdragon 435 | X9 LTE | Q4 2016 | ||||||||
SDM429[55] | Snapdragon 429 | 12 nm (TSMC 12FFC) | 4 cores up to 2.0 GHz Cortex-A53 | Adreno 504 320 MHz (30.7 GFLOPS in FP32) | Hexagon 536 | Up to 16 MP single camera / 8 MP dual camera | X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) | Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 | Q3 2018 | ||
SDM439[56] | Snapdragon 439 | 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53) | Adreno 505 650 MHz (62.4 GFLOPS in FP32) | Up to 21 MP single camera / 8 MP dual camera | |||||||
SDM450[57] | Snapdragon 450 | 14 nm (Samsung 14LPP) | 8 cores up to 1.8 GHz Cortex-A53 | Adreno 505 600 MHz (57.6 GFLOPS in FP32) | Hexagon 546 | Up to 24 MP single camera / 13 MP dual camera | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 | Q3 2017 | |
SM4250-AA[58] | Snapdragon 460 | 11 nm (Samsung 11LPP) | 4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53) | Adreno 610 600 MHz (153.6 GFLOPS in FP32) | Hexagon 683 | Spectra 340 (48 MP single camera / 16 MP dual camera) | LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C | Q1 2020 | |
SM4350[59] | Snapdragon 480 | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55) | Adreno 619 650 MHz (332.8 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C | 4+ | H1 2021 |
SM4350-AC[60] | Snapdragon 480+ | 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55) | FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C | Q4 2021 |
Snapdragon 4 (2022-2024)
The Snapdragon 4 Gen 1 was announced on September 6, 2022.[61]
The Snapdragon 4 Gen 2 was announced on June 26, 2023.[62]
The Snapdragon 4 Gen 2 Leading Version was launched on Redmi Note 13R on May 17, 2024.[63]
The Snapdragon 4s Gen 2 was announced on July 30, 2024.[64]
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SM4375[65] | Snapdragon 4 Gen 1 | 6 nm (TSMC N6) | 2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55) | Adreno 619 700 MHz (358.4 GFLOPS in FP32) | Hexagon | Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1 | 4+ | Q3 2022 |
SM4450[66] | Snapdragon 4 Gen 2 | 4 nm (Samsung 4LPX) | 2 + 6 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55) | Adreno 613 955 MHz (244.5 GFLOPS in FP32) | — | Spectra (108 MP single camera / 16 MP dual camera with ZSL) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) | Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 | Q2 2023 | |
Snapdragon 4 Gen 2 Accelerated Edition[a] | 4 nm (TSMC N4) | 2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55) | Q2 2024 | ||||||||
SM4635[67] | Snapdragon 4s Gen 2 | 4 nm (Samsung) | 2 + 6 cores (2.0 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55) | Adreno 611 | Spectra (84 MP single camera / 16 MP dual camera with ZSL) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal (5G NR Sub-6: download up to 1 Gbit/s) | Q3 2024 |
Snapdragon 6 Series
The Snapdragon 6 Series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon lineup, appearing in mainstream devices of various manufacturers.
Snapdragon 600 series (2013–2023)
The Snapdragon 600 was announced on January 8, 2013.[68] Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro.
The Snapdragon 610 and Snapdragon 615 were announced on February 24, 2014.[69] The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series is a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.[70]
The Snapdragon 616 was announced on July 31, 2015.[71]
The Snapdragon 617 was announced on September 15, 2015.[38]
The Snapdragon 625 was announced on February 11, 2016.[72]
The Snapdragon 626 was announced on October 18, 2016.[73] Snapdragon 625, 626, 632 and 450 are pin and software compatible; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 618 and Snapdragon 620 were announced on February 18, 2015.[37] They have been since renamed as Snapdragon 650 and Snapdragon 652 respectively.[74]
The Snapdragon 653 was announced on October 18, 2016.[40][41]
The Snapdragon 630 and Snapdragon 660 were announced on May 8, 2017.[75]
The Snapdragon 636 was announced on October 17, 2017.[76] Snapdragon 630, 636 and 660 are pin and software compatible.
The Snapdragon 632 was announced on June 26, 2018.[43] Pin and software compatible with Snapdragon 625, 626 and 450; software compatible with Snapdragon 425, 427, 429, 430, 435 and 439.
The Snapdragon 670 was announced on August 8, 2018.[77] Pin and software compatible with Snapdragon 710.
The Snapdragon 675 was announced on October 22, 2018.[78]
The Snapdragon 665 was announced on April 9, 2019.[79][80]
The Snapdragon 662 was announced on January 20, 2020, with NavIC support.[44]
The Snapdragon 678 was announced on December 15, 2020.[81]
The Snapdragon 690 was announced on June 16, 2020, and is the first midrange SoC by Qualcomm to support 5G connectivity.[82]
The Snapdragon 680 and 695 were announced on October 26, 2021.[46]
The Snapdragon 685 was announced on March 23, 2023.
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
APQ8064-1AA (DEB/FLO) Advertised as S4 Pro | Snapdragon 600 | 28 nm (TSMC 28LP) | 4 cores up to 1.5 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 400 MHz (76.8 GFLOPS in FP32) | Hexagon QDSP6 V4 500 MHz | Up to 21 MP single camera; Video Capture: 1080p@30fps | DDR3L-1600 (12.8 GB/sec) | External | Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A | 1.0 | Q1 2013 |
APQ8064M[83] | 4 cores up to 1.7 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s) | |||||||||
APQ8064T[83] | LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s) | ||||||||||
APQ8064AB[83] | 4 cores up to 1.9 GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 2 MB L2 | Adreno 320 450 MHz (86.4 GFLOPS in FP32) | |||||||||
MSM8936[84] | Snapdragon 610 | 4 cores 1.7 GHz Cortex-A53 | Adreno 405 550 MHz (52.8 GFLOPS in FP32) | Hexagon V50 700 MHz | LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s) | X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | Bluetooth 4.0, Qualcomm VIVE 802.11ac NFC, GPS, GLONASS, BeiDou | 2.0 | Q3 2014 | ||
MSM8939[85] | Snapdragon 615 | 4 + 4 cores (1.7 GHz + 1.1 GHz Cortex-A53) | |||||||||
MSM8939 v2[86] | Snapdragon 616 | 4 + 4 cores (1.7 GHz + 1.2 GHz Cortex-A53) | Q3 2015 | ||||||||
MSM8952[87] | Snapdragon 617 | 4 + 4 cores (1.5 GHz + 1.2 GHz Cortex-A53) | Hexagon 546 | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) | Bluetooth 4.1, VIVE 1-stream 802.11n/ac Wi-Fi, IZat Gen8C; USB 2.0 | 3.0 | Q4 2015 | |||
MSM8953[88] | Snapdragon 625 | 14 nm (Samsung 14LPP) | 8 cores up to 2.0 GHz Cortex-A53 | Adreno 506 650 MHz (62.4 GFLOPS in FP32) | Up to 24 MP single camera; Video Capture: 4K@30fps | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1, NFC, VIVE 1-stream 802.11n/ac MU-MIMO Wi-Fi, IZat Gen8C; USB 3.0 | Q2 2016 | |||
MSM8953 Pro[89] | Snapdragon 626 | 8 cores up to 2.2 GHz Cortex-A53 | Q4 2016 | ||||||||
SDM630[90] | Snapdragon 630 | 4 + 4 cores (2.2 GHz + 1.8 GHz Cortex-A53)[91][92] | Adreno 508 650 MHz (124.8 GFLOPS in FP32) | Hexagon 642 | Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps) | LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.1 | 4.0 | Q2 2017 | |
SDM632[93] | Snapdragon 632 | 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53)[94] | Adreno 506 725 MHz (69.6 GFLOPS in FP32) | Hexagon 546 | Up to 40 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps | LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | 3.0 | Q3 2018 | ||
SDM636[95] | Snapdragon 636 | 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53) | Adreno 509 430 MHz (110.1 GFLOPS in FP32) | Hexagon 680 | Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | 4.0 | Q4 2017 | ||
MSM8956[96] | Snapdragon 650 | 28 nm (TSMC 28HPM) | 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) | Adreno 510 600 MHz (153.6 GFLOPS in FP32) | Hexagon V56 | Up to 21 MP single camera; Video Capture: 4K@30fps | LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s) | X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) | Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 | 3.0 | Q1 2016 |
MSM8976[97] | Snapdragon 652 | 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53) | |||||||||
MSM8976 Pro[98] | Snapdragon 653 | 4 + 4 cores (1.95 GHz Cortex-A72 + 1.40 GHz Cortex-A53) | Adreno 510 621 MHz (159 GFLOPS in FP32) | X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Q4 2016 | ||||||
SDM660[99] | Snapdragon 660 | 14 nm (Samsung 14LPP) | 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53) | Adreno 512 647 MHz (165.6 GFLOPS in FP32) | Hexagon 680 | Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 | 4.0 | Q2 2017 |
SDA660[100] | Internal: no | ||||||||||
SM6115[101] | Snapdragon 662 | 11 nm (Samsung 11LPP) | 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53) | Adreno 610 950 MHz (243.2 GFLOPS in FP32) | Hexagon 683 | Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps) | LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC, USB C | 3.0 | Q1 2020 |
SM6125[102] | Snapdragon 665 | Hexagon 686 (3.3 TOPS) | Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5, NFC, 802.11ac Wi-Fi, USB 3.1 | Q2 2019 | |||||
SDM670[103] | Snapdragon 670 | 10 nm (Samsung 10LPP) | 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55)[104] | Adreno 615 430 MHz (220.2 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s) | Bluetooth 5, NFC, 802.11ac Wi-Fi up to 867 Mbit/s, USB 3.1 | 4+ | Q3 2018 | |
SM6150[105] | Snapdragon 675 | 11 nm (Samsung 11LPP) | 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55)[106] | Adreno 612 845 MHz (216.3 GFLOPS in FP32) | Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | Q1 2019 | |||||
SM6150-AC[107] | Snapdragon 678 | 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55) | Adreno 612 895 MHz (229.1 GFLOPS in FP32) | Q4 2020 | |||||||
SM6225[108] | Snapdragon 680 | 6 nm (TSMC N6) | 4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53) | Adreno 610 1114 MHz (285.2 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) | FastConnect 6100, Bluetooth 5.1, NFC, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, NavIC, USB C | 3.0 | Q4 2021 |
SM6225-AD[109] | Snapdragon 685 | 4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53) | Adreno 610 1260 MHz (322.6 GFLOPS in FP32) | Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) | FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 1x1, USB 3.1 | Q1 2023 | |||||
SM6350[110] | Snapdragon 690 | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55) | Adreno 619L 565 MHz (289.3 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) | Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.1, NFC, 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB 3.1 | 4+ | H2 2020 |
SM6375[111] | Snapdragon 695 | 6 nm (TSMC N6) | 2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55) | Adreno 619 840 MHz (430.1 GFLOPS in FP32) | Hexagon 686 (3.3 TOPS) | Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C | Q4 2021 |
Snapdragon 6 (2022–2024)
The Snapdragon 6 Gen 1 was announced on September 6, 2022.[61]
The Snapdragon 6s Gen 3 was announced on June 6, 2024.
The Snapdragon 6s Gen 1 was launched on Oppo A3x on August 9, 2024.[112]
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SM6450[113] | Snapdragon 6 Gen 1 | 4 nm (Samsung 4LPX) | 4 + 4 cores (2.2 GHz Kryo Gold – Cortex-A78 + 1.8 GHz Kryo Silver – Cortex-A55) | Adreno 710 676 MHz (346.1 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | Q1 2023 |
SM6115 | Snapdragon 6s Gen 1 | 4 + 4 cores (2.1 GHz Kryo Gold – Cortex-A73 + 2.0 GHz Kryo Silver – Cortex-A53) | Adreno 610 1050 MHz (268.8 GFLOPS in FP32) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Q3 2024 | ||||||
SM6375-AC[114] | Snapdragon 6s Gen 3 | 6 nm (TSMC N6) | 2 + 6 cores (2.3 GHz Kryo Gold – Cortex-A78 + 2.0 GHz Kryo Silver – Cortex-A55) | Adreno 619 | Hexagon | Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) | Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) | FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C | 4+ | Q2 2024 |
Snapdragon 7 Series
On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series, and primarily aimed at premium mid-range segment.[115]
Snapdragon 700 series (2018–2022)
The Snapdragon 710 was announced on May 23, 2018.[116] It is pin and software compatible with the Snapdragon 670.
The Snapdragon 712 was announced on February 6, 2019.[117]
The Snapdragon 730 and 730G were announced on April 9, 2019.[79][118]
The Snapdragon 720G was announced on January 20, 2020.[44]
The Snapdragon 732G was announced on August 31, 2020.[119]
The Snapdragon 765 and 765G were announced on December 4, 2019[120] as Qualcomm's first SoCs with an integrated 5G modem, and the first 700 series SoCs to support updatable GPU Drivers via the Play Store.[121]
The Snapdragon 768G was announced on May 10, 2020.[122]
The Snapdragon 750G was announced on September 22, 2020.[123]
The Snapdragon 780G was announced on March 25, 2021.[124]
The Snapdragon 778G was announced on May 19, 2021.[125]
The Snapdragon 778G+ was announced on October 26, 2021.[46]
The Snapdragon 782G was announced on November 23, 2022.[126]
Model number | Product Name | Fab | CPU (ARMv8.2) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SDM710[127] | Snapdragon 710 | 10 nm (Samsung 10LPP) | 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55) | Adreno 616 504 MHz (258 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | LPDDR4X Dual-channel 16-bit (32-bit), 1866 MHz (14.9 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.0; NFC; 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | 4 | Q2 2018 |
SDM712[128] | Snapdragon 712 | 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55) | Adreno 616 610 MHz (312.3 GFLOPS in FP32) | 4+ | Q1 2019 | ||||||
SM7125[129] | Snapdragon 720G | 8 nm (Samsung 8LPP) | 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55) | Adreno 618 750 MHz (384 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1 | Q1 2020 | |||
SM7150-AA,[130] | Snapdragon 730 | 2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55) | Adreno 618 610 MHz (312.3 GFLOPS in FP32) | Hexagon 688 (3.6 TOPs) | Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q2 2019 | ||||
SM7150-AB[131] | Snapdragon 730G | Adreno 618 700 MHz (358.4 GFLOPS in FP32) | |||||||||
SM7150-AC[132] | Snapdragon 732G | 2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55) | Adreno 618 800 MHz (409.6 GFLOPS in FP32) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q3 2020 | ||||||
SM7225[133] | Snapdragon 750G | 2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55) | Adreno 619 800 MHz (409.6 GFLOPS in FP32) | Hexagon 694 (4.7 TOPs) | Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s) | Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6200; Bluetooth 5.1; NFC; 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO); GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q4 2020 | ||
SM7250-AA,[134] | Snapdragon 765 | 7 nm (Samsung 7LPP) | 1x 2.3 GHz {765} Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 540 MHz (414.7 GFLOPS in FP32) | Hexagon 696 (5.4 TOPs) | Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) | FastConnect 6200; Bluetooth 5.0; NFC; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q1 2020 | |||
SM7250-AB[135] | Snapdragon 765G | 1x 2.4 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 625 MHz (480 GFLOPS in FP32) | ||||||||
SM7250-AC[136] | Snapdragon 768G | 1x 2.8 GHz Kryo 475 Prime (Cortex-A76) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55) | Adreno 620 750 MHz (576 GFLOPS in FP32) | FastConnect 6200; Bluetooth 5.2; NFC; 802.11a/b/g/n/ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q2 2020 | ||||||
SM7325[137] | Snapdragon 778G | 6 nm (TSMC N6) | 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 550 MHz (563.2 GFLOPS in FP32) | Hexagon 770 (12 TOPs) | Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | Q2 2021 | |
SM7325-AE[138] | Snapdragon 778G+ | 1x 2.5 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 608 MHz (622.6 GFLOPS in FP32) | Q4 2021 | |||||||
SM7350-AB[139] | Snapdragon 780G | 5 nm (Samsung 5LPE) | 1x 2.4 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642 490 MHz (752.6 GFLOPS in FP32) | Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s) | Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | Q1 2021 | ||
SM7325-AF[140] | Snapdragon 782G | 6 nm (TSMC N6) | 1x 2.7 GHz Kryo 670 Prime (Cortex-A78) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55) | Adreno 642L 719 MHz (736.3 GFLOPS in FP32) | Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | Q4 2022 |
Snapdragon 7 (2022–2024)
The Snapdragon 7 Gen 1 was announced on May 20, 2022.[141]
The Snapdragon 7+ Gen 2 was announced on March 17, 2023.[142]
The Snapdragon 7s Gen 2 was announced on September 15, 2023.
The Snapdragon 7 Gen 3 was announced on November 17, 2023.[143]
The Snapdragon 7+ Gen 3 was announced on March 21, 2024.[144]
The Snapdragon 7s Gen 3 was announced on August 20, 2024.[145]
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SM7450-AB[146] | Snapdragon 7 Gen 1 | 4 nm (Samsung 4LPX) | 1x 2.4 GHz {2.5 GHz Accelerated Edition} Kryo Prime (Cortex-A710) + 3x 2.36 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510) | Adreno 644 443 MHz (680.4 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | Q2 2022 |
SM7475-AB[147] | Snapdragon 7+ Gen 2 | 4 nm (TSMC N4) | 1x 2.91 GHz Kryo Prime (Cortex-X2) + 3x 2.49 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510) | Adreno 725 580 MHz (1187.8 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2023 | ||
SM7435-AB[148] | Snapdragon 7s Gen 2 | 4 nm (Samsung 4LPX) | 4 + 4 cores (2.4 GHz Kryo Gold – Cortex-A78 + 1.95 GHz Kryo Silver – Cortex-A55) | Adreno 710 940 MHz (481.3 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | Q3 2023 |
SM7550-AB[149] | Snapdragon 7 Gen 3 | 4 nm (TSMC N4P) | 1x 2.63 GHz Kryo Prime (Cortex-A715) + 3x 2.4 GHz Kryo Gold (Cortex-A715) + 4x 1.8 GHz Kryo Silver (Cortex-A510) | Adreno 720 975 MHz (998.4 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2023 | |
SM7675-AB[150] | Snapdragon 7+ Gen 3 | 1× 2.8 GHz Kryo Prime (Cortex-X4) + 4× 2.6 GHz Kryo Gold (Cortex-A720) + 3× 1.9 GHz Kryo Silver (Cortex-A520) | Adreno 732 950 MHz (1459.2 GFLOPS in FP32) | Hexagon | Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) | LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | Q1 2024 | |||
SM7635[151] | Snapdragon 7s Gen 3 | 1× 2.5 GHz Kryo Prime (Cortex-A720) + 3× 2.4 GHz Kryo Gold (Cortex-A720) + 4× 1.8 GHz Kryo Silver (Cortex-A520) | Adreno 810 | Hexagon | Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) | LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) | FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 4+ | Q3 2024 |
Snapdragon 8 Series
The Snapdragon 8 Series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.
Snapdragon 800 series (2013–2021)
Features of the Snapdragon 800 series |
---|
The Snapdragon 800 was announced on January 8, 2013.[68]
The Snapdragon 801 was announced on February 24, 2014.[154][155]
The Snapdragon 805 was announced on November 20, 2013.[157]
The Snapdragon 808 and 810 were announced on April 7, 2014.[162]
Snapdragon 810 notable features over its lower end version (808):[167]
The Snapdragon 820 was announced at the Mobile World Congress in March 2015,[169] with the first phones featuring the SoC released in early 2016.[170][171]
The Snapdragon 821 was announced in July 2016.[176] The 821 provides a 10% improvement in performance over the 820 due to a faster clocked CPU, but otherwise has similar features, with Qualcomm stating that the 821 is designed to complement rather than replace the 820.[176]
The Snapdragon 835 was announced on November 17, 2016.[178]
The Snapdragon 845 was announced on December 7, 2017.[183][184]
The Snapdragon 855 was announced on December 5, 2018.[193][194] The Snapdragon 855 is Qualcomm's first 7 nm FinFET chipset.
The Snapdragon 855+ was announced on July 15, 2019.[205] It is an overclocked version of the Snapdragon 855 providing 10% higher CPU and GPU performance. The Snapdragon 860 was announced on March 22, 2021. It is a pure rebranding of the Snapdragon 855+. The Snapdragon 865 was announced on December 4, 2019.[206]
The Snapdragon 865+ was announced on July 8, 2020.[212] The Snapdragon 870 was announced on January 19, 2021.[213] The only difference between it and the Snapdragon 865+ is a minor 0.1 GHz increase in clock frequency on the prime core. The Snapdragon 888 was announced on December 1, 2020.[214][215][216][217][218]
The Snapdragon 888+ was announced on June 28, 2021.[224] |
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
APQ8074AA[225] | Snapdragon 800 | 28 nm (TSMC 28HPM) | 4 cores up to 2.26 GHz Krait 400 | Adreno 330 450 MHz (115.2 GFLOPS in FP32) | Hexagon QDSP6 V5 600 MHz | Up to 21 MP single camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | — | Bluetooth 4.0; 802.11n/ac (2.4/5 GHz); IZat Gen8B | 2.0 | Q2 2013[68] |
MSM8274AA[225] | Gobi 3G (UMTS) | ||||||||||
MSM8674AA[225] | Gobi 3G (CDMA/UMTS) | ||||||||||
MSM8974AA[225] | Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) | ||||||||||
MSM8974AA v3[155] | Snapdragon 801 | Gobi 4G (LTE Cat 4) | Q3 2014 | ||||||||
APQ8074AB v3[155] | 4 cores up to 2.36 GHz Krait 400 | Adreno 330 578 MHz[226] (150 GFLOPS in FP32) | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | — | Q4 2013 | ||||||
MSM8274AB[225] | Snapdragon 800 | Gobi 3G (UMTS) | Q4 2013[227] | ||||||||
MSM8674AB v3[155] | Snapdragon 801 | Gobi 3G (CDMA/UMTS) | Q2 2013[68] | ||||||||
MSM8974AB v3[155] | Gobi 4G (LTE Cat 4) | Q4 2013 | |||||||||
MSM8274AC v3[155] | 4 cores up to 2.45 GHz[228] Krait 400[229] | Gobi 3G (UMTS) | Q2 2014[68] | ||||||||
MSM8974AC v3[155] | Gobi 4G (LTE Cat 4) | Q1 2014[68] | |||||||||
APQ8084[230] | Snapdragon 805 | 4 cores up to 2.7 GHz Krait 450 | Adreno 420 600 MHz (153.6 GFLOPS in FP32) | Hexagon V50 800 MHz | Up to 55 MP single camera | LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s) | External | Bluetooth 4.1; 802.11n/ac (2.4/5 GHz); IZat Gen8B | Q1 2014 | ||
MSM8992[163][231] | Snapdragon 808 | 20 nm (TSMC) | 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53)[232] | Adreno 418 600 MHz[233] (153.6 GFLOPS in FP32) | Hexagon V56 800 MHz | Up to 21 MP single camera | LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s) | X10 LTE (Cat 9: download up to 450 Mbit/s, upload up to 50 Mbit/s)[234] | Bluetooth 4.1; 802.11ac; IZat Gen8C | Q3 2014[235] | |
MSM8994[167][231] | Snapdragon 810 | 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53)[236] | Adreno 430 600 MHz (230.4 GFLOPS in FP32) | Up to 55 MP single camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | ||||||
MSM8994v2[237] | Adreno 430 630 MHz[237] (241.9 GFLOPS in FP32) | 2015[237] | |||||||||
MSM8994v2.1[238] | Q2 2015 | ||||||||||
MSM8996 Lite[239] | Snapdragon 820 | 14 nm FinFET (Samsung 14LPP) | 2 + 2 cores Kryo (1.804 GHz + 1.363 GHz) | Adreno 530 510 MHz (261.1 GFLOPS in FP32) | Hexagon 680 1 GHz | Spectra | LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM.) | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C | 3.0 | Q1 2016 |
MSM8996[239] | 2 + 2 cores Kryo (2.15 GHz + 1.593 GHz) | Adreno 530 624 MHz (319.5 GFLOPS in FP32) | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | Q4 2015 | |||||||
MSM8996 Pro-AB[240][241] | Snapdragon 821 | Q3 2016 | |||||||||
MSM8996 Pro-AC[240][241][242] | 2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz) | Adreno 530 653 MHz (334.3 GFLOPS in FP32) | |||||||||
MSM8998[243] | Snapdragon 835 | 10 nm FinFET (Samsung 10LPE) | 4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53) | Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32) | Hexagon 682 | Spectra 180 | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s) | X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4.0 | Q2 2017[244] |
SDM845[185] | Snapdragon 845 | 10 nm FinFET (Samsung 10LPP) | 4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55) | Adreno 630 710 MHz (727 GFLOPS in FP32) | Hexagon 685 (3 TOPs) | Spectra 280 | X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) | 4+ | Q1 2018 | ||
SM8150[245] | Snapdragon 855 | 7 nm (TSMC N7) | 1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55) | Adreno 640 585 MHz (898.6 GFLOPS in FP32) | Hexagon 690 (7 TOPs) | Spectra 380 | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G[246] (5G NR Sub-6 & mmWave: download up to 5 Gbit/s) | Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q1 2019 | |
SM8150-AC[247] | Snapdragon 855+ | 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 640 675 MHz (1036.8 GFLOPS in FP32) | Q3 2019 | |||||||
Snapdragon 860 | Q1 2021 | ||||||||||
SM8150P | Snapdragon 855+ | Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) | Q3 2019 | ||||||||
SM8250[248] | Snapdragon 865 | 7 nm (TSMC N7P) | 1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | Adreno 650 587 MHz (901.6 GFLOPS in FP32) | Hexagon 698 (15 TOPs) | Spectra 480 | LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) | Internal: no + External : X55 5G[249] (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) | FastConnect 6800; Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q1 2020 | |
SM8250-AB[250] | Snapdragon 865+ | 1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | Adreno 650 670 MHz (1029.1 GFLOPS in FP32) | FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q3 2020 | ||||||
SM8250-AC[251] | Snapdragon 870 | 1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55) | FastConnect 6800; Bluetooth 5.2;[252] 802.11a/b/g/n/ac/ax (Wi-Fi 6) up to 1.774 Gbit/s; 802.11ad/ay 60 GHz Wi-Fi up to 10 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS, SBAS; USB 3.1 | Q1 2021 | |||||||
SM8350[253] | Snapdragon 888 | 5 nm (Samsung 5LPE) | 1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) | Adreno 660 840 MHz (1290.2 GFLOPS in FP32) | Hexagon 780 (26 TOPs) | Spectra 580 | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q1 2021 |
SM8350-AC[254] | Snapdragon 888+ | 1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) | Hexagon 780 (32 TOPs) | Q3 2021 |
Snapdragon 8/8+ Gen 1 (2022)
The Snapdragon 8 Gen 1 was announced on November 30, 2021.[255][256]
Notable features over its predecessor (888):
- 4 nm (Samsung 4LPX) process
- ~ billion transistors
- Support up to 16 GB LPDDR5 3200 MHz[257]
- Quick Charge 5 (100 W+)
- Support UFS 3.1
- CPU features
- 1 Kryo Prime (ARM Cortex-X2), up to 3 GHz. Prime core
- 3 Kryo Gold (ARM Cortex-A710), up 2.5 GHz. Performance cores
- 4 Kryo Silver (ARM Cortex-A510), up 1.8 GHz. Efficiency cores
- Move to instruction set ARMv9 (From ARMv8.2-A)
- DynamIQ with 4 MB sL3,
- 20% performance uplift and 30% power efficiency improvement
- 6 MB system-level cache
- GPU features
- Adreno 730 GPU with API Support: OpenGL ES 3.2, OpenCL 2.0 FP, Vulkan 1.1
- 30% faster graphics rendering and 25% more power efficient[258]
- Up to 1024 ALU (From 768 on Adreno 660)
- Demura and subpixel rendering for OLED uniformity
- Variable Rate Shading Pro
- HDR video playback formats: HDR10, HDR10+, Dolby Vision, HLG
- HDR gaming (including 10-bit color depth, Rec. 2020 color gamut)
- On-device display: 4K@60 Hz, QHD+@144 Hz
- External display: 4K@60 Hz, 10-bit, Rec. 2020, HDR10, HDR10+
- DSP features
- Hexagon with Fused AI Accelerator, INT8 and INT16
- Hexagon Tensor Accelerator
- Hexagon Vector eXtensions
- Hexagon Scalar Accelerator
- Qualcomm Sensing Hub (3nd generation)
- New dedicated AI pro
- Hexagon with Fused AI Accelerator, INT8 and INT16
- ISP features[259]
- Qualcomm Spectra with triple 18-bit CV-ISPs and hardware accelerator for computer vision
- Single camera: 1x 200 MP or 108 MP at 30 fps with MFNR/ZSL (Multi Frame Noise Reduction/Zero Shutter Lag)
- Dual camera: 64+36 MP at 30 fps with MFNR/ZSL
- Triple camera: 3x 36 MP at 30 fps with MFNR/ZSL
- 8K 30 FPS and 4K 120 FPS HDR video + 64 MP Photo
- Slow-m 5G NR, LTE including CBRS
- WCDMA, HSPA, TD-SCDMA, CDMA 1x, EV-DO, GSM/EDGE
- 720p @ 960 FPS
- HDR video capture formats: HEVC with HDR10, HDR10+, Dolby Vision, HLG
- HDR photo capture: 10-bit HDR HEIF
- Computational HDR photo and video capture, support for Multi-Frame and Staggered HDR sensors
- Real-time object classification, segmentation, and replacement
- AI-based auto-focus, auto-exposure and auto-white-balance
- Modem and wireless features:
- Internal X65 5G Modem
- Modes: NSA, SA, TDD, FDD
- 5G mmWave
- 5G sub-6 GHz
- 5G NR Sub-6 + mmWave download: 10 Gbit/s
- 5G NR Sub-6 + mmWave upload: 3 Gbit/s (assumed)[260]
- LTE download: 2.5 Gbit/s
- LTE upload: 0.316 Gbit/s
- Dynamic Spectrum Sharing (DSS)
- Bluetooth 5.3
- Qualcomm Aqstic audio codec (WCD9385)
- Provide lossless wireless audio with Qualcomm aptX Technology.
- Qualcomm Wi-Fi 6-ready mobile platform:
- Qualcomm FastConnect 6900
- Wi-Fi standards: 802.11ax-ready (Wi-Fi 6E), 802.11ac Wave 2, 802.11a/b/g, 802.11n
- Wi-Fi spectral bands: 2.4 GHz, 5 GHz, 6 GHz • channel utilization: 20/40/80/160 MHz
- MIMO configuration: 2x2 (2 Spatial Stream) • MU-MIMO • Dual-band simultaneous (DBS) (2×2 + 2×2)
- Peak speed: 3.6 Gbit/s[259]
The Snapdragon 8+ Gen 1 was announced on May 20, 2022.[141]
Model number | Product Name | Fab | CPU (ARMv9) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
---|---|---|---|---|---|---|---|---|---|---|---|
SM8450[256] | Snapdragon 8 Gen 1 | 4 nm (Samsung 4LPX) | 1x 3.0 GHz Kryo Prime (Cortex-X2) + 3x 2.5 GHz Kryo Gold (Cortex-A710) + 4x 1.8 GHz Kryo Silver (Cortex-A510) | Adreno 730 818 MHz (1675.3 GFLOPs in FP32) | Hexagon 52 TOPS, some cases up to 104 TOPS | Spectra | LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) | Internal: X65 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s) | FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2021[261] |
SM8475[262] | Snapdragon 8+ Gen 1 | 4 nm (TSMC N4) | Adreno 730 900 MHz (1843.2 GFLOPS in FP32) | Q2 2022[263] | |||||||
1x 3.2 GHz Kryo Prime (Cortex-X2) + 3x 2.75 GHz Kryo Gold (Cortex-A710) + 4x 2.0 GHz Kryo Silver (Cortex-A510) |
Snapdragon 8 Gen 2 (2023)
The Snapdragon 8 Gen 2 was announced on November 15, 2022.[264]
Notable features over its predecessor (8 Gen 1):
- 4nm (TSMC N4) process
- Support up to 16 GB LPDDR5X 4200 MHz
- Support UFS 4.0
- CPU features
- 1 Kryo Prime (ARM Cortex-X3), up to 3.36 GHz. Prime core
- 1 MB L2 cache
- Only 64-bit support [265]
- 2 Kryo Gold (ARM Cortex-A715), up to 2.8 GHz. High Performance cores
- Only 64-bit support [265]
- 2 Kryo Gold (ARM Cortex-A710), up to 2.8 GHz. Performance cores
- 32-bit and 64-bit support[265]
- 3 Kryo Silver (ARM Cortex-A510), up to 2 GHz. Efficiency cores
- 32-bit and 64-bit support[265]
- 35% performance uplift and 40% power efficiency improvement
- 8 MB system-level cache
- 1 Kryo Prime (ARM Cortex-X3), up to 3.36 GHz. Prime core
- GPU features
- Adreno 740 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
- 25% faster graphics rendering and 45% more power efficient
- Up to 1536 ALU (From 1024 on Adreno 730)
- Real-time hardware-accelerated ray tracing
- ray-box and ray-triangle intersections
- Bounding Volume Hierarchical (BVH)
- Doubled bandwidth between ISP, Hexagon DSP, and Adreno GPU
- DSP features
- ISP features
- Video capture up to 8K30 or 4K120 or 720p960 (HDR)
- Video playback up to 8K60 or 4K120 (HDR)
- H.264, H.265, VP9 and add AV1 decoding [265]
- Photo is same as 8 Gen 1
- Modem and wireless features:
- Similar as 8 Gen 1
- Qualcomm FastConnect 7800
- Internal X70 5G Modem
- 5G up to 10 Gbit/s down and 3,5 Gbit/s up [260]
- Wi-Fi 7 support
- Bluetooth 5.3 support
- Dual Bluetooth radios
There is an overclocked variant of the Snapdragon 8 Gen 2 with model number SM8550-AC. It was exclusive to the Samsung Galaxy S23 series on launch. Nubia's Red Magic 8S Pro became the first non-Galaxy phone to feature this variant,[266] launching July 5th 2023.[267]
Model number | Product Name | Fab | CPU (ARMv9) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
---|---|---|---|---|---|---|---|---|---|---|---|
SM8550-AB[268] | Snapdragon 8 Gen 2 | 4 nm (TSMC N4) | 1× 3.2 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510) | Adreno 740 680 MHz (2089 GFLOPS in FP32) | Hexagon | Spectra | LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[269] or FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1[270][271] | 5 | Q4 2022[264] |
SM8550-AC | Snapdragon 8 Gen 2 for Galaxy[b] | 1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.0 GHz Kryo Silver (Cortex-A510) | Adreno 740 719 MHz (2208.8 GFLOPS in FP32) | Q1 2023 |
Snapdragon 8/8s Gen 3 (2024)
The Snapdragon 8 Gen 3 was announced on October 24, 2023.[272]
Notable features over its predecessor (8 Gen 2):
- Support for memory up to 4800 MHz (up from 4200 MHz)
- CPU features
- 1 Kryo Prime (ARM Cortex-X4), up to 3.3 GHz. Prime core
- 3 Kryo Gold (ARM Cortex-A720), up to 3.2 GHz. High Performance cores
- 2 Kryo Gold (ARM Cortex-A720), up to 3.0 GHz. Performance cores
- 2 Kryo Silver (ARM Cortex-A520), up to 2.3 GHz. Efficiency cores
- 30% performance uplift and 20% power efficiency improvement
- 12 MB L3 cache (up from 8 MB)
- GPU features
- Adreno 750 GPU with API support: OpenGL ES 3.2, OpenCL 2.0, Vulkan 1.3
- 25% faster graphics rendering and 25% more power efficient
- DSP features
- Hexagon NPU 98% faster performance and 40% improved performance-per-watt for sustained AI inferencing.
- ISP features
- Photo expansion
- Video Object Eraser
- Night Vision video capture
- Dolby HDR video capture
- Modem and wireless features:
- Internal X75 5G Modem
- Bluetooth 5.4 support
The Snapdragon 8s Gen 3 was announced on March 18, 2024.[273]
Model number | Product Name | Fab | CPU (ARMv9) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Released |
---|---|---|---|---|---|---|---|---|---|---|---|
SM8650-AB[274] | Snapdragon 8 Gen 3 | 4 nm (TSMC N4P) | 1× 3.30 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520) | Adreno 750 903 MHz (2774 GFLOPS in FP32) | Hexagon | Spectra | LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s) | Internal: X75 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s) | FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s; GPS, GLONASS, NavIC, Beidou, Galileo, QZSS; USB 3.1 | 5 | Q4 2023[272] |
SM8650-AC | Snapdragon 8 Gen 3 for Galaxy | 1× 3.40 GHz Kryo Prime (Cortex-X4) + 3× 3.15 GHz Kryo Gold (Cortex-A720) + 2× 2.96 GHz Kryo Gold (Cortex-A720) + 2× 2.27 GHz Kryo Silver (Cortex-A520) | Adreno 750 1000 MHz (3072 GFLOPS in FP32) | Q1 2024 | |||||||
SM8635[275] | Snapdragon 8s Gen 3 | 1× 3.0 GHz Kryo Prime (Cortex-X4) + 4× 2.8 GHz Kryo Gold (Cortex-A720) + 3× 2.0 GHz Kryo Silver (Cortex-A520) | Adreno 735 1100 MHz (1689.6 GFLOPS in FP32) | LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s) | Internal: X70 5G (5G NR Sub-6 & mmWave: download up to 6.5 Gbit/s, upload up to 3.5 Gbit/s) | Q1 2024[276] |
Mobile Compute Platforms
Snapdragon 835 and Snapdragon 850
The first and second generation of Qualcomm Compute Platforms for Windows PCs are based on mobile Snapdragon processors with PC specific modifications.
The Snapdragon 835 Mobile PC Platform for Windows 10 PCs was announced on December 5, 2017.[183]
The Snapdragon 850 Mobile Compute Platform for Windows 10 PCs, was announced on June 4, 2018.[277] It is essentially an over-clocked version of the Snapdragon 845.
Model number | Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
MSM8998[278] | Snapdragon 835 Mobile PC Platform | 10 nm (Samsung 10LPE) | Kryo 280 4 + 4 cores (2.6 GHz + 1.9 GHz) | Adreno 540 710 MHz (363.5 GFLOPS in FP32) | Hexagon 682 | Spectra 180 (Up to 32 MP camera / 16 MP dual) | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) | X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5; 802.11a/b/g/n/ac/ad Wave 2(MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS | 4 | Q2 2018 |
SDM850[279] | Snapdragon 850 Mobile Compute Platform | 10 nm (Samsung 10LPP) | Kryo 385 4 + 4 cores (2.96 GHz + 1.77 GHz) | Adreno 630 710 MHz (727 GFLOPS in FP32) | Hexagon 685 (3 TOPS) | Spectra 280 (192 MP single camera / 16 MP at 30fps Dual Camera with MFNR/ZSL) | LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s) | X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) | 4+ | Q3 2018 |
Snapdragon 7c/7c+ Compute Platforms
The Snapdragon 7c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[280]
The Snapdragon 7c Gen 2 Compute Platform was announced on May 24, 2021.[281]
The Snapdragon 7c+ Gen 3 Compute Platform was announced on December 1, 2021.[282]
Model number | Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SC7180[283] | Snapdragon 7c | 8 nm (Samsung 8LPP) | Kryo 468 2 + 6 cores (up to 2.4 GHz) | Adreno 618 825 MHz (422.4 GFLOPS in FP32) | Hexagon 692 (5 TOPS) | Spectra 255 (Up to 32 MP camera / 16 MP dual) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) | X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 5; 802.11a/b/g/n/ac/ad/ax (Wi-Fi 6); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC; USB 3.1; eMMC 5.1, UFS 3.0 | Q1 2020 | |
SC7180P[284] | Snapdragon 7c Gen 2 | Kryo 468 2 + 6 cores (up to 2.55 GHz) | Q2 2021 | ||||||||
SC7280[285] | Snapdragon 7c+ Gen 3 | 6 nm (TSMC N6) | Kryo 4 Gold + 4 Silver cores (Cortex-A78r1p1, up to 2.4 GHz) + Cortex-A55 r2p0 | Hexagon (6.5 TOPS) | Spectra (64 MP single camera / 36+22 MP dual camera) | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) | Internal: X53 5G/LTE (5G: download up to 3.7 Gbit/s, upload up to 2.9 Gbit/s; LTE Cat 24/22: download up to 1200 Mbit/s, upload up to 210 Mbit/s) | FastConnect 6700, Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD | Q1 2022 |
Snapdragon 8c Compute Platforms
The Snapdragon 8c Compute Platform for Windows 10 PCs was announced on December 5, 2019.[280]
Model number | Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SC8180[286] | Snapdragon 8c | 7 nm (TSMC N7) | Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz) | Adreno 675 590 MHz | Hexagon 690 (9 TOPS) | Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s) | Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X55 5G/LTE[249] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | Bluetooth 5; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q1 2020 |
Snapdragon 8cx Compute Platforms
The Snapdragon 8cx Compute Platform for Windows 10 PCs was announced on December 6, 2018.[287][288][289]
Notable features over the Snapdragon 855:
- 10 MB total cache (L3 + SLC)
- 8x 16-bit memory bus, (68.3 GB/s)
- NVM Express 4x
- 112.05 mm2 die size[290]
The Snapdragon 8cx Gen 2 5G Compute Platform for Windows 10 PCs was announced on September 3, 2020.[291]
The Snapdragon 8cx Gen 3 Compute Platform was announced on December 1, 2021.[282][292][293]
Notable features over the Snapdragon 888:
- 8 MB L3 cache & 6 MB SLC (14 MB total cache)
- 8x 16-bit memory bus, (68.3 GB/s)
- NVM Express 4x
- Built-in Microsoft Pluton TPM[294]
Model number | Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|---|
SC8180X[295] | Snapdragon 8cx | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 680 585 MHz (1797.1 GFLOPS in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (32 MP single camera / 16 MP at 30fps dual camera with MFNR/ZSL)[296] | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) | Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q3 2019 |
SC8180XP[297] | Snapdragon 8cx Gen 2 5G | Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55) | Adreno 690 660 MHz (2027.5 GFLOPS in FP32) | No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE[249] (5G: download up to 7 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.4 Gbit/s, NFC, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD | Q3 2020 | |||||
SC8280[298] | Snapdragon 8cx Gen 3 | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78)[292] | Adreno 695 900 MHz (3686.4 GFLOPS in FP32) | Hexagon (15 TOPS)[299] | Spectra (24 MP at 30fps single camera with MFNR/ZSL) | No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD | Q1 2022 |
Microsoft SQ Compute Platforms
The Microsoft SQ1 was announced on October 2, 2019.[300][301] Co-developed with Microsoft, it was exclusively designed for Microsoft's Surface Pro X. Technically, it's a Snapdragon 8cx SoC with faster Adreno 685 GPU core providing performance of 2100 GFLOPs.
The Microsoft SQ2 was announced on October 1, 2020.[302]
Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|
Microsoft SQ1 | 7 nm (TSMC N7) | Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55) | Adreno 685 590MHz (1812.5 GFLOPs in FP32) | Hexagon 690 (9 TOPS) | Spectra 390 (192 MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) | Bluetooth 5.0; 802.11a/b/g/n/ac/ad; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1; UFS 3.0, NVMe SSD | 4+ | Q4 2019 |
Microsoft SQ2 | Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55) | Adreno 690 680MHz (2089 GFLOPs in FP32) | Q4 2020 | |||||||
Microsoft SQ3[303][304] | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78) | Adreno 695 900MHz (3686.4 GFLOPS in FP32) | Hexagon (15 TOPS)[305] | Spectra (24 MP at 30fps single camera with MFNR/ZSL) | No internal modem Optional external X62 5G/LTE, X55 5G/LTE, X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | FastConnect 6900, Bluetooth 5.1; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.1, NVMe SSD | Q3 2022 |
Snapdragon X series
The Snapdragon X Elite was announced on October 24, 2023.[306]
The Snapdragon X Plus was announced on April 24, 2024.[307]
Model number | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
Snapdragon X Plus[308][309] | |||||||||
X1P-64-100 | 4 nm (TSMC N4) | Oryon 10 core (3.4 GHz) | Adreno X1 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD | Mid-2024 |
Snapdragon X Elite[310][309] | |||||||||
X1E-78-100 | 4 nm (TSMC N4) | Oryon 12 core (3.4 GHz) | Adreno X1 1250 MHz (3.8 TFLOPS) | Hexagon (45 TOPS) | Spectra (64 MP single camera / 36 MP dual camera) | LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) | No internal modem Optional external X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) | No internal connectivity External FastConnect 7800, Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS, GLONASS, BeiDou, Galileo, QZSS, SBAS, USB4; UFS 4.0, NVMe SSD | Mid-2024 |
X1E-80-100 | Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz) | ||||||||
X1E-84-100 | Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) | Adreno X1 1500 MHz (4.6 TFLOPS) | |||||||
X1E-00-1DE | Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz) |
Hardware codec supported
See: Qualcomm Hexagon
Wearable platforms
The Snapdragon Wear 1100 processor was announced May 30, 2016[311] for GNSS- and LTE-enabled fitness trackers and targeted purpose wearables like smart headsets, and wearable accessories.
The Snapdragon Wear 1200 processor was announced June 27, 2017[312] for GNSS- and LTE-narrowband-IoT-enabled targeted purpose wearables such as kid, pet, elderly, and fitness trackers.
The Snapdragon Wear 2100 processor was announced February 10, 2016 for smartwatches.[313] It is available in both connected (4G/LTE and 3G) and tethered (Bluetooth and Wi-Fi) versions.
The Snapdragon Wear 2500 was announced on June 26, 2018.[314] It is intended for the kid watch segment with special features over the Wear 2100 such as low-power always-on location tracking.
The Snapdragon Wear 3100 was announced on September 10, 2018.[315] The upgrade over the Snapdragon Wear 2100 is the inclusion of the co-processor QCC1110 for low-power background applications such as heart rate tracking and always-on displays.
The Snapdragon Wear 4100 and 4100+ were announced on June 30, 2020.[316] The difference between the two models is the inclusion of the co-processor QCC1110 in the 4100+.
The Snapdragon W5 and W5+ Gen 1 were announced on July 19, 2022.[317] The difference between the two models is the inclusion of the co-processor QCC5100 in the W5+.
Model number | Product Name | Fab | CPU | Co-processor | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|
? | Wear 1100[318] | 28 nm | 1 core up to 1.2 GHz Cortex-A7 (ARMv7) | — | Fixed Function GPU | LPDDR2 | Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) | Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2016[319] | |
Wear 1200[320] | 1 core up to 1.3 GHz Cortex-A7 (ARMv7) | Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) | Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou | Q2 2017[321] | ||||||
MSM8909w[322] | Wear 2100[323] | 4 cores up to 1.2 GHz Cortex-A7 (ARMv7) | Adreno 304 | Hexagon | LPDDR3 400 MHz | X5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 4.1[a]; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou | Q1 2016[324] | ||
Wear 2500[325] | Q2 2018 | |||||||||
Wear 3100[326] | QCC1110 (1 core 50 MHz Cortex-M0) 3100 & 4100+ only | Q3 2018[327] | ||||||||
SDM429w | Wear 4100 and 4100+[328] | 12 nm + 28 nm | 4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A) | Adreno A504 320 MHz | Hexagon QDSP6 V56 | 1x32 bit LPDDR3 750 MHz | Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou | Q2 2020[329] | ||
SW5100 | W5 and W5+ Gen 1[330] | 4 nm + 22 nm | 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A) | QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) W5+ only | Adreno A702 1 GHz | Hexagon DSP V66K | 1x16 bit LPDDR4 2133 MHz | Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) | Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou | Q3 2022[331] |
- ^ Bluetooth 4.2 for Wear 3100
Automotive platforms
The Snapdragon 602A,[332] for application in the motor industry,[333] was announced on January 6, 2014.
The Snapdragon 820A[334] was announced on January 6, 2016.
Model number | Product Name | Fab | CPU | GPU | DSP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
8064-AU[335] | Snapdragon 602A | 28 nm (TSMC 28LP) | 4 cores up to 1.5 GHz Krait 300 (ARMv7) | Adreno 320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display) | Hexagon V40 600 MHz | LPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s) | External Gobi 9x15 (LTE: FDD/TDD Cat 3; CDMA: EV-DOrB/rA; 1x; UMTS: TD-SCDMA, DC-HSPA+/HSPA; GSM: EDGE/GPRS) | Bluetooth 4.1 + BLE; Qualcomm VIVE QCA6574: 802.11n/ac (Wi-Fi 5) 2x2 (MU-MIMO) | Q1 2014 |
MSM8996AU[336] | Snapdragon 820A | 14 nm (Samsung 14LPP) | Kryo 2 + 2 cores (2.15 GHz Gold + 1.59 GHz Silver) (ARMv8) | Adreno 530 624 MHz (319.4 GFLOPs) | Hexagon 680 1 GHz | LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s) | X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) | Bluetooth 4.1; 802.11ac/ad (Wi-Fi 5); IZat Gen8C | Q1 2016 |
SA6155P[337] | 11 nm (Samsung 11LPP) | Kryo 4xx 2 + 6 cores | Adreno 608/612 (110 GFLOPs) | Hexagon | LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) | Internal: no | Bluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS | ||
SA8155P[338][339] | Snapdragon 855A | 7 nm (TSMC N7) | Kryo 485 1 + 3 + 4 cores (2.96 GHz Prime + 2.42 GHz Gold + 1.80 GHz Silver) | Adreno 640 675 MHz (1036.8 GFLOPs) | Hexagon 690 (>10 TOPS) | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)[340] | Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS | Q1 2021 | |
SA8195P[341][342] | Kryo 495 4 + 4 cores (Cortex-A76 + Cortex-A55) | Adreno 680 600 MHz (1843.2 GFLOPs) | Hexagon | LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)[343] | Bluetooth 5.0; 802.11a/b/g/n/ac/ad/ay/ax-ready (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS | ||||
SA8255P | 5 nm (Samsung 5LPE) | Kryo 4 + 4 cores (2.35 GHz Prime + 2.35 GHz Gold) | Adreno 663 | Hexagon | LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s) | Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6); GPS; GLONASS; Beidou; Galileo; QZSS; SBAS | |||
SA8295P | Kryo 695 4 + 4 cores (2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78) | Adreno 695 | Hexagon (30 TOPS) | LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s) | Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 1.8 Gbit/s; GPS; GLONASS; Beidou; Galileo; QZSS; SBAS | 2023 |
Embedded platforms
The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016.[344][345]
The Snapdragon 800 for Embedded
The Snapdragon 810 for Embedded
The Snapdragon 820E Embedded was announced on February 21, 2018.[346]
Model number | Product Name | Fab | CPU | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|
APQ8016E[347] | Snapdragon 410E | 28 nm (TSMC 28LP) | 4 cores up to 1.2 GHz Cortex-A53 (ARMv8) | Adreno 306 | Hexagon QDSP6 V5 691 MHz | Up to 13 MP camera | LPDDR2/3 Single-channel 32-bit 533 MHz (4.2 GB/s) | none | Bluetooth 4.0, 802.11n, GPS | |
APQ8064E[348] | Snapdragon 600E | 4 cores up to 1.5 GHz Krait 300 (ARMv7) | Adreno 320 400 MHz | Hexagon QDSP6 V4 500 MHz | Up to 21 MP camera | DDR3/DDR3L Dual-channel 533 MHz | Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A | |||
APQ8074[349] | Snapdragon 800E | 28 nm (TSMC 28HPM) | 4 cores up to 2.3 GHz Krait 400 (ARMv7) | Adreno 330 | Hexagon QDSP6 V5 | Up to 55 MP camera | LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s) | Bluetooth 4.1; 802.11n/ac (2.4 and 5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, and JTAG; USB 3.0/2.0 | ||
APQ8094[350] | Snapdragon 810E | 20 nm (TSMC 20SoC) | 4 + 4 cores (2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53; ARMv8) | Adreno 430 650 MHz | Hexagon V56 800 MHz | Up to 55 MP camera | LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s) | Bluetooth 4.1; 802.11ac; IZat Gen8C | ||
APQ8096[351] | Snapdragon 820E | 14 nm FinFET (Samsung 14LPP) | 2 + 2 cores (2.15 GHz + 1.593 GHz Kryo; ARMv8) | Adreno 530 | Hexagon 680 825 MHz | Up to 28 MP camera | LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s) | Bluetooth 4.1; 802.11ac/ad; IZat Gen8C |
Vision Intelligence Platform
The Qualcomm Vision Intelligence Platform[352] was announced on April 11, 2018.[353][354] The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.
Model number | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Modem | Connectivity | Quick Charge | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|
QCS603[355] | 10 nm (Samsung 10LPP) | 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) | Adreno 615 (Quad HD + 4K Ultra HD external display) | Hexagon 685 | Spectra 270 (Up to 24 MP camera / 16 MP dual) | LPDDR4X 16-bit 1866 MHz | none | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 | 4+ | |
QCS605[356] | 8 cores up to 2.5 GHz Kryo 300 | Spectra 270 (Up to 32 MP camera / 16 MP dual) | Bluetooth 5.0, NFC, 802.11a/b/g/n/ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 |
Home Hub and Smart Audio platforms
The Qualcomm Smart Audio Platform (APQ8009 and APQ8017)[357] was announced on June 14, 2017.[358]
The Qualcomm 212 Home Hub (APQ8009)[359] and Qualcomm 624 Home Hub (APQ8053)[360] were announced on January 9, 2018.[361]
The QCS400 Series was announced March 19, 2019.[362]
Model number | Fab | CPU | GPU | DSP | ISP | Audio | Memory technology | Modem | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|---|
APQ8009[363][357] (SDA212)[364] | 28 nm (TSMC 28LP) | 4 cores up to 1.3 GHz Cortex-A7 (ARMv7) | Adreno 304 (HD) | Hexagon 536 | Up to 16 MP camera | LPDDR2/3 Single-Channel 533 MHz | none | Bluetooth 4.2 + BLE, 802.11a/b/g/n/ac (2.4/5 GHz) Wi-Fi | ||
APQ8017[357] | 4 cores up to 1.4 GHz Cortex-A53 (ARMv8) | Adreno 308 (Full HD) | LPDDR3 Single-channel 667 MHz | |||||||
APQ8053[365] (SDA624)[366] | 14 nm (Samsung 14LPP) | 8 cores up to 1.8 GHz Cortex-A53 (ARMv8) | Adreno 506 (Full HD+) | Hexagon 546 | Up to 24 MP camera / 13 MP dual | LPDDR3 | ||||
QCS403[367] | Dual-core CPU | none | 2x Hexagon V66 | 12x Audio Channels Supported | Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 | Q1 2019 | ||||
QCS404[368] | Quad-core CPU | |||||||||
QCS405[369] | Adreno 306 (Full HD+) | |||||||||
QCS407[370] | 32x Audio Channels Supported |
Mixed Reality (MR) platforms
Snapdragon XR series
- In May 2018, Qualcomm announced the Snapdragon XR1 Platform, their first purpose-built SoC for Augmented reality, Virtual reality and mixed reality. Qualcomm also announced that HTC Vive, Pico, Meta, and Vuzix would be announcing consumer products featuring the XR1 by the end of 2018.[371]
- The Snapdragon XR2 5G Platform was announced on December 5, 2019, and is a derivative of the Snapdragon 865.[372][failed verification][373] It is used in the Meta Quest 2, the HTC Vive Focus 3 and the Pico 4.
- The Snapdragon XR2+ Gen 1 Platform was announced on October 11, 2022,[374] and is used in the Meta Quest Pro.
- On September 27, 2023 Qualcomm announced the Snapdragon XR2 Gen 2 Platform for MR and VR headsets.[375] Qualcomm claims 2.5x higher GPU and 8x better AI performance compared to its predecessor the XR2 5G. The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.[376] With the support of Wi-Fi 7 network throughput is increased by 60% while latency is decreased by 80%. The platform debuted on the Meta Quest 3.
- The Snapdragon XR2+ Gen 2 Platform is an overclocked version of the XR2 Gen 2 announced on January 4, 2024.[377] The GPU frequency has been increased by 15% while the CPU frequency has been increased by 20% compared to the XR2 Gen 2. This enables a higher 4.3K resolution per-eye at 90 Hz and the processing of 12 or more concurrent cameras and sensors. This chip forms the basis of the XR headset and ecosystem jointly developed by Qualcomm, Samsung, and Google that has been announced at Galaxy Unpacked in February 2023.[378]
Product Name | Fab | CPU (ARMv8) | GPU | DSP | ISP | Memory technology | Tracking | Connectivity | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
XR1[379] | 10 nm (Samsung 10LPP) | 4x Kryo 385 Gold + 4x Kryo 385 Silver | Adreno 615 | Hexagon 685 | Spectra | LPDDR4X | 3DoF and 6DoF head and controller tracking | WiFi 5 Bluetooth 5 | Q1 2019 |
XR2[380] | 7 nm (TSMC N7+) | 1x Kryo 585 Prime + 3x Kryo 585 Gold + 4x Kryo 585 Silver | Adreno 650 (up to 2x 3K displays at 90 Hz) | Hexagon 698 | Spectra (input from up to 7 cameras) | Full 6DoF head and controller tracking, as well as hand and finger tracking | WiFi 6 Bluetooth 5 5G | Q1 2020 | |
XR2+ Gen1[381] | LPDDR5 | WiFi 6E Bluetooth 5.2 5G | Q4 2022 | ||||||
XR2 Gen2[382] | 4 nm (TSMC N4) | 1x Kryo Prime + 4x Kryo Gold + 3x Kryo Silver | Adreno 740 (up to 2x 3K displays at 90 Hz) | Hexagon | Spectra (input from up to 10 cameras) | LPDDR5X | WiFi 7 Bluetooth 5.3 5G | Q4 2023 | |
XR2+ Gen2[383] | Adreno 740 (up to 2x 4.3K displays at 90 Hz) | Hexagon | Spectra (input from up to 12 cameras) | Q1 2024 |
Snapdragon AR series
The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022.[384] It is intended for use in smart glasses.[385]
On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses.[375] It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).
Gaming platforms
Snapdragon G series
In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform.[386][387] The Razer Edge is the first device to use the platform.[388] Analyzing Geekbench listings for the Razer Edge[389] it is fair to assume that the G3x Gen 1 is a rebranding of the Snapdragon 888+ as it has the same motherboard code name (Lahaina), the same CPU clusters and clock speeds, and the same GPU. Connectivity options also seem in line.
In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.[390]
Product Name | CPU | GPU | Modem | Connectivity | Display | Sampling availability |
---|---|---|---|---|---|---|
G1 Gen 1[391] | Kryo (8 core) | Adreno A11 | — | Wi-Fi 5, Bluetooth 5.0 | HD at 60 fps | Q4 2023 |
G2 Gen 1[392] | Adreno A21 | X62 5G/LTE | Wi-Fi 6/6E, Bluetooth 5.0 | FHD+ up to 144 fps | ||
G3x Gen 1[393] | 1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55) | Adreno 660 900 MHz (1382.4 GFLOPs in FP32) | X60 5G/LTE | Wi-Fi 6E, Bluetooth 5.2 | Q1 2023 | |
G3x Gen 2[394][395] | 1× 3.36 GHz Kryo Prime (Cortex-X3) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715, 2× Cortex-A710) + 3× 2.02 GHz Kryo Silver (Cortex-A510) | Adreno A32 1000 MHz (3072 GFLOPS in FP32) | X70 5G/LTE | Wi-Fi 7, Bluetooth 5.3 | Q4 2023 |
Bluetooth SoC platforms
Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa, Google Assistant and Google Fast Pair.[396][397] Qualcomm announced the QCC5100 Series at CES 2018.[398]
On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG.[399][400] On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series.[401] On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.[402][403]
Qualcomm QCC300x Series Bluetooth audio SoCs
Model number | Fab | CPU | DSP | Bluetooth | Technologies support | Power consumption | DAC output / Digital microphone input | Sampling availability |
---|---|---|---|---|---|---|---|---|
QCC3001[404] | RISC application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 80 MHz) | Bluetooth 5.0 Dual-mode Bluetooth | TrueWireless Stereo cVc audio | Mono / 2-mic | |||
QCC3002[405] | TrueWireless Stereo aptX Classic/HD/LL cVc audio | |||||||
QCC3003[406] | cVc audio | Stereo / 1-mic | ||||||
QCC3004[407] | Stereo / 2-mic | |||||||
QCC3005[408] | aptX Classic/HD/LL cVc audio |
Qualcomm QCC30xx Series Bluetooth audio SoCs
Model number | Fab | CPU | DSP | Bluetooth | Technologies support | Power consumption | DAC output / Digital microphone input | Digital Assistant activation | Sampling availability |
---|---|---|---|---|---|---|---|---|---|
QCC3020[409] | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | ~6mA (2DP streaming) | Mono / 2-mic | Button press | H1 2017 | |
QCC3021[410] | Stereo / 1-mic | ||||||||
QCC3024[411] | cVc audio Google Fast Pair | Stereo / 2-mic | |||||||
QCC3026[412] | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | Mono / 2-mic | |||||||
QCC3031[413] | aptX Classic/HD/LL TrueWireless Stereo Plus cVc audio | Stereo / 1-mic | |||||||
QCC3034[414] | aptX Classic/HD/LL cVc audio Google Fast Pair | Mono / 2-mic | |||||||
QCC3040[415] | Dual core 32-bit application processor (Up to 80 MHz) | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2[399][400] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s | aptX Classic/HD TrueWireless mirroring ANC (Feedforward/feedback and hybrid) cVc audio Google Fast Pair | <5 mA | Stereo / 2-mic | Button press | H1 2020 | |
QCC3046[416] | <5 mA |
Qualcomm QCC510x Series Bluetooth audio SoCs
Model number | Fab | CPU | DSP | Bluetooth | Technologies support | Power consumption | Digital Assistant activation | Sampling availability |
---|---|---|---|---|---|---|---|---|
QCC5120[417] | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode Bluetooth Bluetooth Speed: 2 Mbit/s | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback and Hybrid) cVc audio Google Fast Pair | ~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc | Button press Qualcomm Voice Activation | H1 2018 | |
QCC5121[418] | ||||||||
QCC5124[419] | ||||||||
QCC5125[420] | Single core Qualcomm Kalimba DSP (Up to 120 MHz) | aptX Classic/HD/LL eXtension program TrueWireless Stereo Plus ANC (FeedForward/Feedback) cVc audio Google Fast Pair | ~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc | Button press | ||||
QCC5141[421] | Dual core 32-bit application processor (Up to 80 MHz) | Dual core Qualcomm Kalimba DSP (Up to 120 MHz) | Bluetooth 5.2[399][400] BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s | aptX Adaptive eXtension program TrueWireless Mirroring ANC (FeedForward/Feedback) cVc audio Google Fast Pair | ~5mA A2DP stream | Button press Qualcomm Voice Activation | H1 2020 | |
QCC5144[422] |
See also
- List of devices using Qualcomm Snapdragon systems on chips
- Qualcomm Adreno
- Qualcomm Hexagon
- List of Qualcomm Snapdragon modems
- Apple M1
- Tegra
- Exynos
- HiSilicon
- List of MediaTek systems on chips
- List of UNISOC systems on chips
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